EP2SGX60EF1152C3

The EP2SGX60EF1152C3 is a Stratix II GX field-programmable gate array featuring a high-performance logic array combined with the Stratix II GX family’s high-speed serial transceiver architecture. This device targets communications and high-speed interface applications that require dense logic, substantial embedded memory, and extensive I/O connectivity.

With 60,440 logic elements, approximately 2.54 Mbits of embedded memory and 534 I/Os in a 1152-BBGA package, the device delivers integration for protocol bridging, backplane interfaces, and high-speed data processing while operating from a 1.15 V–1.25 V supply across a commercial 0 °C to 85 °C range.

Key Features

• Logic Capacity — 60,440 logic elements provide a large fabric for implementing complex control, processing, and protocol logic.
• Embedded Memory — Approximately 2.54 Mbits of on-chip RAM, including TriMatrix memory with multiple block sizes to support true dual-port memory and FIFO implementations with high-performance operation.
• High-Speed Transceivers (series) — Stratix II GX family transceivers support full-duplex operation from 600 Mbps up to 6.375 Gbps per channel and family devices include 4 to 20 channels, enabling high-bandwidth serial links and protocol flexibility.
• DSP and Clock Resources (series) — Dedicated high-speed DSP blocks and up to 16 global clock networks (with multiple regional clocks) support high-performance multiply-accumulate functions and synchronous designs.
• I/O and Interface Density — 534 I/O pins support a wide variety of single-ended and differential standards; the family also supports source-synchronous differential I/O and common bus standards for high-speed parallel interfaces.
• Package & Mounting — 1152-BBGA (supplier package: 1152-FBGA 35×35) in a surface-mount form factor for compact board-level integration.
• Power & Temperature — Nominal supply range 1.15 V to 1.25 V and commercial operating range 0 °C to 85 °C for mainstream system deployments.
• Security & Configuration (series) — Series-level support for configuration bitstream encryption and remote configuration updates to help protect design IP and enable field updates.
• Compliance — RoHS compliant.

Typical Applications

• High-Speed Communications — Implement protocol bridging and line-rate interfaces using the family’s high-speed transceivers and dense logic resources.
• Backplane and Chip-to-Chip Interfaces — Leverage serial transceivers and source-synchronous I/O for backplane links and board-to-board connectivity.
• Signal Processing and DSP — Use embedded DSP blocks and on-chip memory for FIR filters, multiply-accumulate operations, and packet processing tasks.
• Memory Interfaces — Support for high-speed external memory interfaces and on-chip TriMatrix RAM for buffering, packet FIFO, and shared memory architectures.

Unique Advantages

• High Integration: Combines a large logic array, significant embedded memory, and extensive I/O in a single 1152-BBGA package to reduce board-level component count.
• Scalable High-Speed Links: Family transceivers supporting up to 6.375 Gbps per channel enable scalable serial bandwidth for evolving interface requirements.
• Flexible Memory Architecture: TriMatrix memory with multiple block sizes simplifies implementation of dual-port memories and high-performance FIFOs.
• Rich Clocking and DSP Resources: Multiple global/regional clock networks and dedicated DSP blocks support high-performance, timing-critical designs.
• Design Security and Field Update Support: Series-level bitstream encryption and remote configuration features help protect IP and enable in-field upgrades.
• RoHS Compliant, Surface-Mount Packaging: Compliant materials and a compact BGA footprint support modern PCB assembly and environmental requirements.

Why Choose EP2SGX60EF1152C3?

The EP2SGX60EF1152C3 offers a balanced combination of dense logic (60,440 logic elements), substantial embedded memory (approximately 2.54 Mbits), and a high I/O count (534 pins) in a compact 1152-BBGA package. It is positioned for designers needing integrated high-speed serial capabilities alongside robust on-chip memory and DSP resources for communications and high-performance interface applications.

As part of the Stratix II GX family, the device benefits from series-level features such as high-speed transceivers, configurable PLLs and clocking resources, and support for Altera Megacore/AMPP megafunctions and configuration security—providing a development ecosystem suited for medium- to high-complexity systems that require scalability and design flexibility.

Request a quote or submit an inquiry to receive pricing and lead-time information for the EP2SGX60EF1152C3 and evaluate how this Stratix II GX device fits your next high-speed FPGA design.