EP2SGX60EF1152C4

The EP2SGX60EF1152C4 is a commercial-grade Stratix II GX FPGA offered in a 1152-ball BGA package. It combines a high-performance logic array with the Stratix II GX family’s high-speed serial transceiver architecture to address demanding communications and high-speed interface applications.

Designed for applications that require dense logic, abundant I/O and embedded memory, this device provides 60,440 logic elements, approximately 2.54 Mbits of embedded memory, and 534 user I/Os while operating at a core supply range of 1.15 V to 1.25 V and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 60,440 logic elements to implement complex digital functions and system-level integration.
• Embedded Memory — Approximately 2.54 Mbits of on-chip RAM for FIFOs, buffers and on-chip storage.
• I/O and Packaging — 534 user I/Os in a 1152-ball BGA (supplier package: 1152-FBGA, 35 × 35 mm) optimized for high-density, surface-mount board designs.
• Power and Temperature — Core voltage supply range 1.15 V to 1.25 V; commercial operating range 0 °C to 85 °C.
• Transceiver Architecture (family) — Stratix II GX family devices include high-speed serial transceivers with clock and data recovery supporting 600 Mbps to 6.375 Gbps per channel and protocols such as PCI Express and Gigabit Ethernet.
• Memory Architecture (family) — TriMatrix memory structure for multiple RAM block sizes and high-performance true dual-port memories and FIFOs.
• DSP & Clock Resources (family) — Dedicated high-speed DSP blocks and up to 16 global clock networks with regional clocking for timing-critical applications; up to four enhanced PLLs for advanced clocking control.
• Compliance — RoHS compliant; commercial-grade device and surface-mount mounting type.

Typical Applications

• High-speed Networking — Implement protocol bridging and packet processing using the Stratix II GX transceiver family capabilities and dense logic resources.
• Backplane & Chip-to-Chip Interfaces — Support high-bandwidth serial links and parallel interfaces with abundant I/O and embedded memory for buffering and alignment.
• Communications Systems — Enable SERDES-based links and protocol-specific IP cores using the family’s transceiver and clocking features.
• Custom Hardware Acceleration — Use on-chip DSP blocks and large logic capacity to accelerate signal processing and algorithmic functions.

Unique Advantages

• High Logic Density: 60,440 logic elements provide capacity to consolidate multiple functions or large custom datapaths into a single FPGA device.
• Substantial On-chip Memory: Approximately 2.54 Mbits of embedded RAM reduces dependence on external memory for buffering and small data stores.
• Extensive I/O Count: 534 user I/Os in a compact 1152-ball BGA package enables dense connector and peripheral interfacing on modern PCBs.
• Family-Level High-Speed Transceivers: Stratix II GX transceiver technology supports up to 6.375 Gbps per channel and common serial protocols, enabling versatile link options.
• Commercial-Grade Robustness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial electronics deployments.
• Flexible Clocking and DSP Resources: Family features such as multiple global/regional clock networks, enhanced PLLs, and dedicated DSP blocks support performance-focused designs.

Why Choose EP2SGX60EF1152C4?

The EP2SGX60EF1152C4 positions itself as a high-capacity, commercially graded Stratix II GX FPGA that balances dense logic, substantial embedded memory and broad I/O in a 1152-BBGA package. Its core voltage range and temperature rating make it suitable for mainstream communications, networking, and high-speed interface applications that rely on family-level transceiver and DSP capabilities.

Design teams seeking a scalable platform with strong clocking, memory architecture and serial-link support will find this device suited for complex protocol bridging, packet processing and custom hardware acceleration tasks while leveraging the Stratix II GX device family characteristics.

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