EP2SGX60EF1152I4
| Part Description |
Stratix® II GX Field Programmable Gate Array (FPGA) IC 534 2544192 60440 1152-BBGA |
|---|---|
| Quantity | 463 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA | Number of I/O | 534 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3022 | Number of Logic Elements/Cells | 60440 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2544192 |
Overview of EP2SGX60EF1152I4 – Stratix® II GX FPGA, 1152-BBGA
The EP2SGX60EF1152I4 is a Stratix® II GX field-programmable gate array (FPGA) in a 1152-ball BGA package designed for industrial applications. It pairs a high-density logic array with the Stratix II GX family’s high-speed serial transceiver architecture to address demanding communications, protocol bridging, and backplane interface designs.
With 60,440 logic elements and approximately 2.544 Mbits of embedded memory, this device delivers substantial on-chip resources while supporting an operating voltage range of 1.15 V to 1.25 V and an operating temperature range of −40 °C to 100 °C. It is RoHS compliant and comes in a 1152-FBGA (35×35) supplier package.
Key Features
- Logic Capacity 60,440 logic elements provide the programmable fabric for complex digital designs and system integration.
- On‑chip Memory Approximately 2.544 Mbits of embedded RAM supports FIFOs, dual-port memories, and buffer requirements for high-throughput designs.
- I/O Density 534 user I/O pins enable broad external connectivity for interfaces, memory buses, and high-speed signaling.
- Stratix II GX Transceiver Technology Family-level transceiver capabilities support serial data rates from 600 Mbps to 6.375 Gbps and advanced SERDES features for high-speed link implementation.
- Clocking and DSP Stratix II GX architecture includes multiple global/regional clock resources and dedicated DSP blocks for pipelined multipliers and MAC functions (family-level capability described in the datasheet).
- Package and Mounting 1152-BBGA (supplier package: 1152-FBGA 35×35) surface-mount package for compact board-level integration.
- Power and Voltage Specified core supply range of 1.15 V to 1.25 V to match system power rails and enable predictable power budgeting.
- Industrial Temperature Grade Rated for −40 °C to 100 °C operation to meet robust environmental requirements.
- Regulatory/Environmental RoHS compliant for environmental and regulatory compatibility.
Typical Applications
- High‑Speed Communications Implement serial links and protocol bridging using the Stratix II GX transceiver technology and abundant logic resources.
- Backplane and Chip‑to‑Chip Interfaces Large I/O count and high-speed SERDES support make this device suitable for backplane interfaces and high-bandwidth chip-to-chip links.
- Signal Processing and Acceleration Embedded RAM and DSP-capable architecture support FIR filters, MAC operations, and packet processing pipelines.
- Protocol Gateways Logic density and flexible I/O support enable implementation of protocol conversion and bridging functions in communications equipment.
Unique Advantages
- Substantial Logic and Memory in a Single Device: 60,440 logic elements and approximately 2.544 Mbits of embedded RAM reduce the need for external glue logic and memories.
- High I/O Count: 534 I/O pins support complex system-level interconnects and multiple parallel interfaces without extensive external multiplexing.
- High-Speed Serial Capability (Family-Level): Stratix II GX transceiver architecture supports up to 6.375 Gbps serial data rates, enabling high-bandwidth link implementation.
- Industrial Temperature Range: Qualified for −40 °C to 100 °C operation to support deployments in demanding thermal environments.
- Compact, Serviceable Package: 1152-BBGA (35×35) facilitates high-density PCB designs while delivering necessary ball-out for large FPGAs.
- RoHS Compliance: Meets environmental directives for lead-free manufacturing processes.
Why Choose EP2SGX60EF1152I4?
EP2SGX60EF1152I4 combines the Stratix II GX family’s high-speed serial transceiver architecture with a high-density logic array and significant embedded memory, providing a balanced platform for communications, protocol bridging, and high-throughput processing applications. Its industrial temperature rating, broad I/O, and compact 1152-BBGA package make it suitable for system designs that require robust operation and high integration.
This device is well suited to engineering teams building high-performance network equipment, backplane interfaces, and signal-processing accelerators who need a proven FPGA architecture with clear, verifiable on-chip resources and family-level transceiver capabilities.
Request a quote or submit an inquiry for availability, lead times, and pricing to move your design forward with EP2SGX60EF1152I4.

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