EP2SGX60EF1152I4

IC FPGA 534 I/O 1152FBGA
Part Description

Stratix® II GX Field Programmable Gate Array (FPGA) IC 534 2544192 60440 1152-BBGA

Quantity 463 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGANumber of I/O534Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3022Number of Logic Elements/Cells60440
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2544192

Overview of EP2SGX60EF1152I4 – Stratix® II GX FPGA, 1152-BBGA

The EP2SGX60EF1152I4 is a Stratix® II GX field-programmable gate array (FPGA) in a 1152-ball BGA package designed for industrial applications. It pairs a high-density logic array with the Stratix II GX family’s high-speed serial transceiver architecture to address demanding communications, protocol bridging, and backplane interface designs.

With 60,440 logic elements and approximately 2.544 Mbits of embedded memory, this device delivers substantial on-chip resources while supporting an operating voltage range of 1.15 V to 1.25 V and an operating temperature range of −40 °C to 100 °C. It is RoHS compliant and comes in a 1152-FBGA (35×35) supplier package.

Key Features

  • Logic Capacity  60,440 logic elements provide the programmable fabric for complex digital designs and system integration.
  • On‑chip Memory  Approximately 2.544 Mbits of embedded RAM supports FIFOs, dual-port memories, and buffer requirements for high-throughput designs.
  • I/O Density  534 user I/O pins enable broad external connectivity for interfaces, memory buses, and high-speed signaling.
  • Stratix II GX Transceiver Technology  Family-level transceiver capabilities support serial data rates from 600 Mbps to 6.375 Gbps and advanced SERDES features for high-speed link implementation.
  • Clocking and DSP  Stratix II GX architecture includes multiple global/regional clock resources and dedicated DSP blocks for pipelined multipliers and MAC functions (family-level capability described in the datasheet).
  • Package and Mounting  1152-BBGA (supplier package: 1152-FBGA 35×35) surface-mount package for compact board-level integration.
  • Power and Voltage  Specified core supply range of 1.15 V to 1.25 V to match system power rails and enable predictable power budgeting.
  • Industrial Temperature Grade  Rated for −40 °C to 100 °C operation to meet robust environmental requirements.
  • Regulatory/Environmental  RoHS compliant for environmental and regulatory compatibility.

Typical Applications

  • High‑Speed Communications  Implement serial links and protocol bridging using the Stratix II GX transceiver technology and abundant logic resources.
  • Backplane and Chip‑to‑Chip Interfaces  Large I/O count and high-speed SERDES support make this device suitable for backplane interfaces and high-bandwidth chip-to-chip links.
  • Signal Processing and Acceleration  Embedded RAM and DSP-capable architecture support FIR filters, MAC operations, and packet processing pipelines.
  • Protocol Gateways  Logic density and flexible I/O support enable implementation of protocol conversion and bridging functions in communications equipment.

Unique Advantages

  • Substantial Logic and Memory in a Single Device: 60,440 logic elements and approximately 2.544 Mbits of embedded RAM reduce the need for external glue logic and memories.
  • High I/O Count: 534 I/O pins support complex system-level interconnects and multiple parallel interfaces without extensive external multiplexing.
  • High-Speed Serial Capability (Family-Level): Stratix II GX transceiver architecture supports up to 6.375 Gbps serial data rates, enabling high-bandwidth link implementation.
  • Industrial Temperature Range: Qualified for −40 °C to 100 °C operation to support deployments in demanding thermal environments.
  • Compact, Serviceable Package: 1152-BBGA (35×35) facilitates high-density PCB designs while delivering necessary ball-out for large FPGAs.
  • RoHS Compliance: Meets environmental directives for lead-free manufacturing processes.

Why Choose EP2SGX60EF1152I4?

EP2SGX60EF1152I4 combines the Stratix II GX family’s high-speed serial transceiver architecture with a high-density logic array and significant embedded memory, providing a balanced platform for communications, protocol bridging, and high-throughput processing applications. Its industrial temperature rating, broad I/O, and compact 1152-BBGA package make it suitable for system designs that require robust operation and high integration.

This device is well suited to engineering teams building high-performance network equipment, backplane interfaces, and signal-processing accelerators who need a proven FPGA architecture with clear, verifiable on-chip resources and family-level transceiver capabilities.

Request a quote or submit an inquiry for availability, lead times, and pricing to move your design forward with EP2SGX60EF1152I4.

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