EP2SGX85FF1508I4

EP2SGX85 - STRATIX II SERIES FPG
Part Description

Field Programmable Gate Array (FPGA) IC 1508-BBGA, FCBGA

Quantity 1,146 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAltera
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package1508-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1508-BBGA, FCBGANumber of I/O719Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Affected
Moisture Sensitivity LevelVendor UndefinedNumber of LABs/CLBs4548Number of Logic Elements/CellsN/A
Number of GatesN/AECCN3A991HTS CodeN/A
QualificationN/ATotal RAM BitsN/A

Overview of EP2SGX85FF1508I4 – Field Programmable Gate Array (FPGA) IC, 1508-BBGA (FCBGA)

The EP2SGX85FF1508I4 is an industrial-grade Field Programmable Gate Array (FPGA) from Altera supplied in a 1508-BBGA (FCBGA) surface-mount package. It provides a high-density programmable logic device with 4548 logic elements and 719 user I/O pins for complex digital designs.

Designed for board-level integration, the device operates from a 1.15 V to 1.25 V core supply and supports an ambient operating range of −40 °C to 100 °C. The device is RoHS compliant.

Key Features

  • Core Logic  4548 logic elements provide the programmable fabric required for custom logic, control, and signal processing functions.
  • I/O Density  719 user I/O pins enable extensive connectivity for high-pin-count designs and complex interfacing requirements.
  • Power  Core voltage supply range of 1.15 V to 1.25 V, suitable for systems designed to this core voltage window.
  • Package and Mounting  1508-BBGA (FCBGA) package; supplier device package listed as 1508-FBGA (40×40). Surface-mount construction simplifies automated assembly.
  • Temperature and Reliability  Industrial operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
  • Environmental Compliance  RoHS compliant to support regulatory and sustainability requirements.

Unique Advantages

  • High-density programmable fabric: 4548 logic elements enable implementation of sizeable custom logic and control functions within a single device, reducing board-level component count.
  • Extensive I/O capability: 719 I/O pins provide flexibility for multi-channel interfaces, parallel buses, and large connector arrays without external multiplexing.
  • Industry-grade thermal range: Rated from −40 °C to 100 °C to support deployments across a wide range of industrial conditions.
  • Surface-mount BBGA package: 1508-BBGA/1508-FBGA (40×40) packaging supports compact, automated PCB assembly for space-constrained designs.
  • Controlled core power requirements: Specified 1.15 V to 1.25 V supply simplifies power budgeting for the core rails in system-level design.
  • Regulatory readiness: RoHS compliance helps meet environmental standards and corporate sourcing policies.

Why Choose EP2SGX85FF1508I4?

The EP2SGX85FF1508I4 positions itself as a high-density, industrial-grade FPGA option for designers requiring significant programmable logic and a large I/O complement in a compact surface-mount BBGA package. Its specified core voltage range and broad operating temperature make it suitable for systems that demand consistent electrical and thermal performance.

This device suits engineering teams targeting board-level integration where device density, I/O count, and RoHS compliance are priorities. Its combination of logic capacity, I/O availability, and industrial temperature rating provides a robust foundation for scalable, long-lived embedded designs.

Request a quote or submit an inquiry to receive pricing, availability, and support information for the EP2SGX85FF1508I4.

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