EP2SGX60EF1152I4N
| Part Description |
Stratix® II GX Field Programmable Gate Array (FPGA) IC 534 2544192 60440 1152-BBGA |
|---|---|
| Quantity | 763 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA | Number of I/O | 534 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3022 | Number of Logic Elements/Cells | 60440 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2544192 |
Overview of EP2SGX60EF1152I4N – Stratix® II GX FPGA, 60,440 logic elements, 534 I/O, 1152-BBGA
The EP2SGX60EF1152I4N is an industrial-grade Stratix® II GX field programmable gate array (FPGA) in a 1152-ball BGA package. It combines a high-capacity logic array with on-chip embedded memory and a large I/O count to address high-performance system designs.
Built on the Stratix II GX family architecture, this device targets applications that require substantial user logic, significant embedded RAM, extensive external interfacing, and advanced serial transceiver capabilities provided by the GX series.
Key Features
- Logic Capacity — Approximately 60,440 logic elements to implement complex custom logic, state machines, and glue-logic functions.
- Embedded Memory — Approximately 2.54 Mbits of on-chip RAM for FIFOs, buffers, and storage to support high-throughput designs.
- I/O Density — 534 available I/O pins, enabling broad connectivity to peripherals, memory interfaces, and daughtercards.
- High-speed Serial Capability (family) — Stratix II GX family transceivers support full-duplex operation from 600 Mbps up to 6.375 Gbps and offer features such as clock and data recovery, programmable VOD and pre-emphasis, adaptive equalization, and selectable on-chip termination.
- DSP & Clocking (family) — Dedicated high-speed DSP blocks for multipliers and MAC operations and up to four enhanced PLLs per device for flexible clock management, phase shifting, and dynamic reconfiguration.
- Memory & Interface Support (family) — Family-level support for high-speed external memories including QDR/QDRII, DDR/DDR2 SDRAM and SDR SDRAM, and multiple source-synchronous bus standards.
- Package & Mounting — 1152‑BBGA (supplier package listed as 1152‑FBGA, 35×35) in a surface-mount configuration for high-density board designs.
- Power Supply — Core voltage range specified at 1.15 V to 1.25 V.
- Industrial Temperature Rating — Operating temperature range from −40°C to 100°C for deployment in industrial environments.
- Standards & Security (family) — Family-level support for configuration bitstream encryption and remote configuration updates; includes JTAG boundary-scan testing support.
- Compliance — RoHS compliant.
Typical Applications
- High-speed communications — Implement protocol bridging, backplane interfaces, and chip-to-chip links using the Stratix II GX family transceiver capabilities and large logic resources.
- Network and telecom systems — Support packet processing, buffering, and interface aggregation with abundant logic elements, embedded RAM, and high I/O count.
- High-performance compute and DSP — Offload intensive arithmetic and signal-processing tasks using on-chip DSP resources and dedicated multiply‑accumulate blocks.
- Memory interface and bridging — Act as controller or bridge for high-speed external memories such as DDR/DDR2 and QDR, leveraging on-chip memory and clocking resources.
Unique Advantages
- Substantial logic and memory in one device: ~60,440 logic elements and ~2.54 Mbits of embedded RAM reduce the need for external glue logic and buffers.
- High I/O count for system integration: 534 I/O pins simplify routing to peripherals, mixed-signal front-ends, and memory subsystems.
- Industrial temperature rating: −40°C to 100°C operation enables use in demanding environments.
- Advanced serial link technology (family): GX-series transceivers support multi-gigabit links with programmable signal integrity features for robust high-speed connections.
- Flexible clocking and DSP resources (family): Enhanced PLLs and DSP blocks provide deterministic timing and efficient arithmetic processing for real-time applications.
- RoHS compliant and surface-mount packaging: Meets environmental requirements and supports modern PCB assembly processes in a compact 1152‑BBGA package.
Why Choose EP2SGX60EF1152I4N?
The EP2SGX60EF1152I4N places a large logic fabric, meaningful embedded RAM, and a high I/O count into a single industrial-grade BGA package, making it suited for systems that demand integration, interfacing flexibility, and reliable operation across temperature extremes. As a member of the Stratix II GX family, it benefits from family-level features such as high-speed serial transceivers, DSP resources, and advanced clocking options.
Designers targeting high-performance communications, network equipment, or complex memory interface applications will find this device well matched to reduce board-level complexity and support scalable, robust designs backed by the Stratix II GX architecture and associated IP resources.
Request a quote or submit an inquiry to receive pricing, lead-time, and availability for EP2SGX60EF1152I4N and to discuss how this Stratix II GX FPGA can fit your next design.

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