EP2SGX85FF1508C3N

The EP2SGX85FF1508C3N from Altera is a commercial-grade Field Programmable Gate Array (FPGA) supplied in a 1508-ball BGA (FCBGA) package. It provides 4,548 logic elements and up to 719 general-purpose I/Os, making it suitable for designs that require substantial on-chip logic capacity and large I/O connectivity.

Operating with a core supply range of 1.15 V to 1.25 V and specified for 0 °C to 85 °C ambient, this surface-mount FPGA is designed for integration into a broad set of commercial electronic systems where programmable logic and extensive I/O are needed.

Key Features

• Logic Capacity 4,548 logic elements to implement custom digital logic, finite-state machines, and glue-logic functions.
• I/O Resources Up to 719 I/Os for broad peripheral interfacing, bus bridging, and multi-channel connectivity.
• Power Core voltage supply range of 1.15 V to 1.25 V to match system power rails and regulator choices.
• Package & Mounting 1508-ball BGA (FCBGA) package; supplier device package listed as 1508-FBGA (40×40). Surface-mount mounting type facilitates PCB assembly and dense board layouts.
• Temperature Grade Commercial operating temperature range of 0 °C to 85 °C for standard embedded and consumer applications.
• Regulatory Compliance RoHS-compliant manufacturing to support environmentally compliant product builds.

Typical Applications

• System Prototyping and Development Use the FPGA’s 4,548 logic elements and large I/O count to prototype digital designs, validate interfaces, and iterate hardware-accelerated functions.
• High-Density I/O Interfacing Deploy the device where many parallel or disparate I/O connections are required, such as multi-channel data acquisition front ends or wide bus bridging.
• Custom Control Logic Implement control-state machines, custom timing logic, and board-level glue using the available on-chip logic resources.

Unique Advantages

• Substantial Logic Density: 4,548 logic elements provide a useful balance of programmable resources for medium-complexity designs without external gate arrays.
• Extensive I/O Count: 719 I/Os reduce the need for external multiplexing and simplify board-level connectivity for systems with many peripherals.
• Compact BGA Package: The 1508-BBGA (1508-FBGA 40×40) package enables a high pin count in a compact footprint for space-constrained PCBs.
• Commercial Temperature Range: Rated 0 °C to 85 °C to match typical commercial product deployment and test conditions.
• RoHS Compliance: Environmentally compliant manufacturing supports regulatory requirements for lead-free assemblies.

Why Choose EP2SGX85FF1508C3N?

The EP2SGX85FF1508C3N positions itself as a practical choice for commercial embedded designs that need a programmable logic device with significant logic resources and a very high I/O count. Its combination of 4,548 logic elements, 719 I/Os, and a compact 1508-ball BGA package makes it well suited for applications requiring dense connectivity and on-board customization without expanding PCB area.

For engineering and procurement teams, the device offers a clear specification set—voltage supply range, package details, operating temperature, and RoHS status—enabling straightforward system-level planning, power budgeting, and compliance tracking.

If you would like pricing, availability, or to request a formal quote for EP2SGX85FF1508C3N, please submit a quote request or contact our sales team for further assistance.