EP2SGX90EF1152C3ES

The EP2SGX90EF1152C3ES is a Stratix® II GX field‑programmable gate array (FPGA) in a 1152‑BBGA package designed for high‑performance, high‑integration digital designs. It combines a large logic array, substantial on‑chip memory, and extensive I/O capability to address demanding applications such as high‑speed backplane interfaces, chip‑to‑chip links, and communications protocol bridging.

As a member of the Stratix II GX family, the device benefits from the family’s high‑speed serial transceiver architecture and advanced on‑chip resources, enabling designers to implement complex, bandwidth‑intensive systems with flexible configuration and security options.

Key Features

• High‑density logic — 90,960 logic elements to implement complex digital functions and system logic.
• Embedded memory — approximately 4.5 Mbits of on‑chip RAM (4,520,448 bits) suitable for FIFOs, buffers, and local data storage.
• Extensive I/O — 558 I/O pins to support wide parallel interfaces and numerous peripherals.
• Stratix II GX transceiver family features — family‑level transceiver capability with clock and data recovery and serial data rates up to 6.375 Gbps per channel; devices in the family are available with 4 to 20 high‑speed serial channels.
• TriMatrix memory and DSP resources — family architecture includes TriMatrix RAM blocks for true dual‑port memory and high‑performance DSP blocks for multipliers and MAC/FIR functions (family data references DSP multipliers operating up to 450 MHz).
• Flexible clocking — support for multiple clock networks with up to 16 global clock networks and numerous regional clock networks (family specification).
• Package & mounting — 1152‑BBGA surface‑mount package; supplier device package listed as 1152‑FBGA (35×35).
• Power & operating range — core voltage supply range 1.15 V to 1.25 V; commercial operating temperature range 0 °C to 85 °C.
• Standards & configuration — family supports numerous I/O standards, configuration bitstream encryption, and remote configuration updates (family features).
• RoHS compliant — device meets RoHS environmental status requirements.

Typical Applications

• High‑speed backplane interfaces — implement multi‑lane serial and parallel protocols for backplane routing and switching using the family’s high‑speed transceiver capabilities.
• Communications equipment — protocol bridging and packet processing where high logic density, on‑chip memory, and serial links are required.
• Chip‑to‑chip interconnects — bridging and SERDES‑based links between ASICs, processors, and other FPGAs leveraging transceiver CDR and adaptive equalization features (family‑level).
• Memory interface controllers — integration with external DDR/QDR memories supported by Stratix II GX family architecture for high‑bandwidth buffering and control.

Unique Advantages

• High logic capacity: 90,960 logic elements provide headroom for complex SoC‑style implementations and heavy control logic.
• Substantial on‑chip RAM: approximately 4.5 Mbits of embedded memory reduces external RAM dependence and improves data path performance.
• Large I/O count: 558 I/Os enable wide bus implementations and extensive peripheral connectivity without additional multiplexing.
• High‑speed serial support: family transceivers supporting up to 6.375 Gbps per channel facilitate high‑bandwidth serial links for modern communication protocols.
• Flexible timing and DSP: multiple global and regional clock networks plus dedicated DSP blocks (family up to 450 MHz multipliers) simplify high‑performance signal processing and timing architectures.
• Configuration and security options: family support for configuration bitstream encryption and remote updates helps protect IP and enables field reconfiguration.

Why Choose EP2SGX90EF1152C3ES?

The EP2SGX90EF1152C3ES delivers a balanced combination of high logic density, significant embedded memory, and a large I/O count in a compact 1152‑BBGA package—making it well suited for high‑bandwidth, integration‑heavy designs in communications and data‑centric systems. Its Stratix II GX family features—high‑speed transceivers, TriMatrix memory architecture, DSP resources, and extensive clocking—provide a flexible platform for implementing protocol bridging, high‑speed interfaces, and advanced signal processing.

Designed for commercial‑temperature operation and RoHS compliance, this device supports secure configuration and remote updates while integrating with the Stratix II GX family ecosystem of IP and megafunctions, offering a scalable path for development and deployment.

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