EP2SGX90EF1152C4N

The EP2SGX90EF1152C4N is a Stratix® II GX field programmable gate array (FPGA) in a 1152‑BBGA package tailored for high‑performance, communication‑centric designs. It combines a large programmable logic array with the Stratix II GX family’s high‑speed serial transceiver and clocking capabilities to address demanding backplane, chip‑to‑chip, and protocol‑bridging applications.

With approximately 90,960 logic elements, roughly 4.52 Mbits of embedded memory, and support for a broad set of transceiver and I/O features defined by the Stratix II GX family, this device targets designs that require high integration, flexible clocking and DSP resources, and a wide range of I/O options.

Key Features

• High‑density logic  Approximately 90,960 logic elements to implement complex state machines, packet processing, and protocol bridging.
• Embedded memory  Approximately 4.52 Mbits of on‑chip RAM, supporting TriMatrix memory architecture for true dual‑port RAM and FIFO implementations.
• Stratix II GX transceiver capabilities (family)  Family transceivers provide clock and data recovery (CDR) and support data rates from 600 Mbps up to 6.375 Gbps per channel, with dynamic VOD/pre‑emphasis and receiver adaptive equalization options.
• Clocking and DSP resources  Up to four enhanced PLLs per device family with real‑time reconfiguration and advanced phase control, plus high‑speed DSP blocks for multipliers and MAC/FIR implementations (family‑level characteristics documented in the Stratix II GX datasheet).
• I/O and interface support  558 device I/O pins and support for numerous single‑ended and differential I/O standards and source‑synchronous interfaces as defined by the Stratix II GX family.
• Package and mounting  1152‑BBGA (supplier package: 1152‑FBGA, 35×35 mm) surface‑mount package for compact board footprint and high I/O density.
• Power and supply  Core voltage operation in the range of 1.15 V to 1.25 V, enabling integration into modern low‑voltage power architectures.
• Operating conditions and compliance  Commercial temperature grade with an operating range of 0 °C to 85 °C and RoHS compliant.

Typical Applications

• High‑speed backplane interfaces  Use the Stratix II GX transceiver capabilities and high logic density to implement protocol bridging and packet switching across backplane links.
• Chip‑to‑chip connectivity  Leverage the family’s SERDES/C DR features for reliable high‑data‑rate links between boards or ICs.
• Communications protocol bridging  Deploy on systems that require flexible protocol adaptation and real‑time data processing using embedded memory and DSP resources.
• Memory controller and buffering  Implement high‑speed external memory interfaces and FIFOs using TriMatrix memory and abundant on‑chip RAM.

Unique Advantages

• High logic capacity: Approximately 90,960 logic elements provide the headroom to consolidate multiple functions into a single FPGA, reducing BOM and board complexity.
• Integrated high‑speed serial IP (family): Stratix II GX transceiver features (up to 6.375 Gbps per channel) simplify high‑bandwidth link implementation and signal‑integrity tuning with programmable VOD and pre‑emphasis.
• Flexible embedded memory: Approximately 4.52 Mbits of on‑chip RAM and TriMatrix architecture enable dual‑port RAM and FIFO designs with deterministic performance.
• Advanced clocking and DSP support (family): Enhanced PLLs and dedicated DSP blocks support real‑time clock management and high‑throughput arithmetic functions for signal processing and packet handling.
• High I/O count in compact package: 558 I/O pins in a 1152‑BBGA (35×35 mm) footprint maximize board‑level connectivity while conserving PCB area.
• Compliance and grade: Commercial temperature range (0 °C to 85 °C) and RoHS compliance simplify integration for mainstream electronic products.

Why Choose EP2SGX90EF1152C4N?

The EP2SGX90EF1152C4N delivers a high‑density Stratix II GX FPGA option for designers who need substantial programmable logic, embedded memory, and the family’s high‑speed transceiver and clocking features. Its combination of approximately 90,960 logic elements, TriMatrix memory resources, and broad I/O capability supports consolidation of complex communication and processing functions onto a single device.

This device is suited to engineering teams building high‑bandwidth networking, backplane, and protocol conversion solutions that require scalable performance, flexible clocking, and ample on‑chip memory and DSP resources. RoHS compliance and a standard commercial temperature grade make it straightforward to deploy in mainstream product lines.

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