EP2SGX90EF1152C4ES

The EP2SGX90EF1152C4ES is a Stratix® II GX Field Programmable Gate Array (FPGA) IC from Intel, built around a scalable, high-performance logic array with high-speed serial transceiver capabilities described in the Stratix II GX device handbook. This commercial-grade, surface-mount FPGA targets high-bandwidth communication, backplane, and protocol-bridging designs that demand large logic capacity and substantial on-chip memory.

Key device-level attributes include 90,960 logic elements, approximately 4.52 Mbits of embedded memory, 558 I/O pins, a 1152‑BBGA package footprint, and an operating voltage range of 1.15 V to 1.25 V with commercial temperature grading (0 °C to 85 °C).

Key Features

• High Logic Capacity — 90,960 logic elements to implement complex control, processing, and protocol logic on a single device.
• Embedded Memory — Approximately 4.52 Mbits of on-chip RAM for FIFOs, buffering, and local data storage.
• I/O Density — 558 I/O pins to support wide parallel interfaces and multiple external connections.
• High‑Speed Transceiver Technology (family feature) — Stratix II GX devices are documented to include high-speed serial transceivers supporting data rates up to 6.375 Gbps for point-to-point and protocol-link applications.
• DSP and Clocking (family feature) — The family supports dedicated DSP resources and multiple PLLs for high-performance multiply-accumulate functions and flexible clock management.
• Package and Mounting — 1152‑BBGA (supplier package: 1152‑FBGA, 35×35 mm) in a surface-mount form factor for compact board integration.
• Power and Thermal — Low-voltage core operation with a specified supply range of 1.15 V to 1.25 V and commercial operating temperature from 0 °C to 85 °C.
• Compliance — RoHS‑compliant manufacturing.

Typical Applications

• High‑Speed Backplane Interfaces — Use the device’s family transceiver capabilities and high I/O count to implement backplane links and protocol bridging.
• Chip‑to‑Chip Connectivity — Large logic capacity and on‑chip RAM enable protocol conversion, buffering, and custom interconnect logic between chips.
• Communications Equipment — Implement packet processing, framing, or protocol-specific logic where high logic density and embedded memory are required.

Unique Advantages

• Large Integrable Logic — 90,960 logic elements reduce the need for multiple devices, simplifying system design and reducing BOM complexity.
• Substantial On‑Chip RAM — Approximately 4.52 Mbits of embedded memory supports deep FIFOs and local buffering without external memory for many use cases.
• High I/O Count — 558 I/O pins allow flexible interface routing and parallel bus implementations.
• Compact, High‑Density Package — 1152‑BBGA footprint provides high pin count in a compact surface-mount package suitable for space-constrained boards.
• Defined Commercial Operating Range — Specified 0 °C to 85 °C operation and 1.15 V–1.25 V supply range support standard commercial deployments and power budgeting.
• RoHS Compliant — Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose EP2SGX90EF1152C4ES?

The EP2SGX90EF1152C4ES combines significant logic density, meaningful embedded RAM, and a high I/O count in a compact 1152‑BBGA package, making it suitable for high-bandwidth communications, backplane, and bridging applications where integration and board space matter. As a member of the Stratix II GX family documented in the device handbook, it benefits from the family’s scalable architecture, high-speed transceiver capability, and design features such as flexible clocking and DSP resources.

This device is appropriate for teams designing commercial-grade FPGA systems that require a balance of performance, integration, and available on-chip resources, with the option to leverage documented Stratix II GX device capabilities and megafunction support described in the device handbook.

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