EP2SGX90EF1152C5ES

The EP2SGX90EF1152C5ES is a commercial-grade Stratix® II GX FPGA from Intel, built on a high-performance, scalable logic architecture that combines a dense logic array with the Stratix II GX transceiver ecosystem. With 90,960 logic elements, approximately 4.52 Mbits of embedded memory and 558 user I/O, this device targets demanding communications, networking and protocol-bridging designs that require high I/O density and flexible serial connectivity.

Based on the Stratix II GX family architecture, the device benefits from integrated high-speed serial transceiver technology, multi-level on-chip RAM, and advanced clocking resources—enabling system designers to address high-bandwidth backplane, chip-to-chip and communications interface applications while operating at low core voltages.

Key Features

• Logic Capacity  90,960 logic elements for implementing complex digital designs and large custom logic functions.
• Embedded Memory  Approximately 4.52 Mbits of on-chip RAM to support FIFOs, buffers and memory-intensive algorithms.
• I/O Density  558 user I/O pins to support wide parallel interfaces and flexible board-level connectivity.
• High‑Speed Transceiver Architecture  Stratix II GX family transceiver technology supports clock-and-data recovery and SERDES operation from 600 Mbps up to 6.375 Gbps per channel (family specification), enabling high-bandwidth serial links and protocol support.
• Clocking and DSP  Architecture includes multiple global and regional clock networks, enhanced PLLs with reconfiguration capability, and dedicated DSP/multiplier resources suitable for high-speed signal processing (family features).
• TriMatrix Memory Architecture  Three RAM block sizes (family feature) provide flexible true dual-port memory and FIFO implementations with high performance.
• Power and Voltage  Core voltage supply range: 1.15 V to 1.25 V for low-voltage system designs; supports per-channel power-down for reduced consumption (transceiver family feature).
• Commercial Temperature Range  Rated for 0 °C to 85 °C operation; device grade: Commercial.
• Package & Mounting  1152-BBGA package (supplier device package: 1152-FBGA, 35 × 35 mm) with surface-mount assembly for high-density PCB layouts.
• Regulatory  RoHS compliant.

Typical Applications

• High‑speed Networking Equipment  Implement packet processing, protocol bridging and backplane interfaces using the device’s dense logic, embedded memory and family transceiver capabilities.
• Communications Protocol Conversion  Translate between serial protocols and parallel buses or aggregate multiple serial links using the Stratix II GX transceiver and FPGA fabric.
• Chip‑to‑Chip Interconnect  Use high I/O counts and SERDES-enabled links for board-level or board-to-board high-bandwidth interconnects.
• Signal Processing and DSP Acceleration  Leverage on-chip RAM and DSP resources for filtering, accumulation and other high-speed signal-processing tasks (family features).

Unique Advantages

• High logic density: 90,960 logic elements provide headroom for complex designs and custom IP integration.
• Substantial embedded memory: Approximately 4.52 Mbits of on-chip RAM reduces external memory requirements and simplifies buffer/FIFO implementations.
• Extensive I/O: 558 user I/O pins enable broad peripheral connectivity and support for wide parallel interfaces.
• Low-voltage core operation: 1.15–1.25 V supply supports modern low-voltage system architectures and power-optimized designs.
• Stratix II GX transceiver technology: Family-level support for high-speed serial links and CDR/SERDES capabilities enables flexible, high-bandwidth interfacing.
• RoHS compliant and surface-mount package: Meets environmental compliance requirements and supports compact PCB assembly in a 1152-BBGA form factor.

Why Choose EP2SGX90EF1152C5ES?

The EP2SGX90EF1152C5ES brings a combination of high logic capacity, multi-megabit embedded memory, and abundant I/O in a single commercial‑grade Stratix II GX FPGA package. Its architecture—rooted in the Stratix II GX device family—aligns with designs that require integrated high-speed serial functionality alongside large programmable fabric and memory resources.

This device is well suited for teams developing high-bandwidth communications, backplane and protocol-bridging systems that need scalable logic, on-chip memory and flexible transceiver technology while operating within commercial temperature limits. The platform’s documented architecture and family-level features support long-term design scalability and integration into established development flows.

Request a quote or submit a request for pricing and availability to begin evaluating EP2SGX90EF1152C5ES for your next design.