EP2SGX90EF1152C5N

IC FPGA 558 I/O 1152FBGA
Part Description

Stratix® II GX Field Programmable Gate Array (FPGA) IC 558 4520448 90960 1152-BBGA

Quantity 694 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGANumber of I/O558Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4548Number of Logic Elements/Cells90960
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4520448

Overview of EP2SGX90EF1152C5N – Stratix® II GX Field Programmable Gate Array (FPGA) IC 558 4520448 90960 1152-BBGA

The EP2SGX90EF1152C5N is a Stratix® II GX family FPGA from Intel, combining a scalable high‑performance logic array with the Stratix II GX series’ advanced serial-transceiver architecture. This device targets designs that require dense programmable logic, substantial on-chip memory, and flexible high-speed I/O connectivity.

Typical markets include high-speed communications, networking and protocol-bridging applications where integrated transceiver capability, robust clocking and DSP resources accelerate time to market and simplify system design.

Key Features

  • Logic Capacity — 90,960 logic elements for implementing complex digital functions and system-level logic integration.
  • Embedded Memory — Approximately 4.52 Mbits of on-chip RAM (4,520,448 total RAM bits) to support FIFOs, packet buffering and data path storage.
  • I/O — 558 user I/O pins providing broad connectivity for parallel and source‑synchronous interfaces.
  • High‑Speed Transceiver Architecture — Stratix II GX family transceiver technology supporting high-speed serial protocols (family-level capability up to 6.375 Gbps and multi-channel configurations) for backplane, chip‑to‑chip and serial protocol bridging.
  • DSP and Clocking — Family features include high-speed DSP blocks and multiple global/regional clock networks with enhanced PLLs for flexible clocking and accelerated signal processing (family-level capabilities described in the Stratix II GX device handbook).
  • Package & Mounting — 1152-BBGA package (supplier package: 1152-FBGA, 35×35 mm) with surface-mount mounting type for compact board integration.
  • Power — Core voltage supply 1.15 V to 1.25 V to match system power domains and enable predictable power planning.
  • Operating Range — Commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • High‑Speed Networking Equipment — Implement backplane interfaces and packet processing pipelines using the device’s dense logic, on-chip RAM and Stratix II GX transceiver capabilities.
  • Telecom & Data Transport — Support protocol bridging and serial link aggregation leveraging family transceiver features and flexible clocking resources.
  • Embedded System Acceleration — Offload compute‑intensive DSP tasks with on‑die DSP blocks and hardware‑accelerated multiply/accumulate functions described for the Stratix II GX family.
  • Memory Interface Controllers — Deploy controllers for high‑speed external memories using the embedded RAM and I/O flexibility to implement buffer and timing-critical logic.

Unique Advantages

  • High Logic Density: 90,960 logic elements enable consolidation of multiple subsystems into a single FPGA to reduce board-level BOM and interconnect complexity.
  • Substantial Embedded Memory: Approximately 4.52 Mbits of on‑chip RAM supports deep FIFOs and buffering without immediate external memory dependence.
  • Broad I/O Count: 558 I/O pins provide the capacity to interface with wide parallel buses, multiple high-speed lanes, or dense peripheral sets.
  • Stratix II GX Transceiver Technology: Family-level support for multi‑Gbps serial channels and protocol reconfiguration simplifies high-speed link design and enables flexible protocol support.
  • Flexible Clocking & DSP Resources: Family features such as multiple global/regional clock networks, enhanced PLLs and DSP blocks facilitate synchronized data paths and real-time signal processing.
  • Commercial Grade & RoHS Compliant: Rated for 0 °C to 85 °C operation and compliant with RoHS for regulatory and manufacturing consistency.

Why Choose EP2SGX90EF1152C5N?

The EP2SGX90EF1152C5N positions designers to integrate substantial logic, memory and I/O bandwidth with the Stratix II GX family’s high‑speed transceiver and DSP capabilities. It is suited for teams building high‑throughput networking, communications and embedded acceleration systems that require a balance of programmable density and serial link flexibility.

Backed by Intel’s Stratix II GX device handbook and family megafunction support, this device provides a scalable platform for designs that may evolve over time—helping reduce redevelopment effort through a familiar architecture and available family‑level resources.

Request a quote or submit an availability inquiry to get pricing, lead time and ordering information for EP2SGX90EF1152C5N.

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