EP2SGX90EF1152I4

The EP2SGX90EF1152I4 is a Stratix II GX field‑programmable gate array (FPGA) offered in a 1152‑BBGA/1152‑FBGA (35×35) surface‑mount package. Built on the Stratix II GX architecture, the device targets high‑performance, high‑density logic and communications applications that require extensive I/O, on‑chip memory, and support for high‑speed serial transceivers.

With 90,960 logic elements, approximately 4.52 Mbits of embedded memory, and 558 I/Os, this industrial‑grade FPGA is designed for demanding environments where integration, configurable high‑speed interfaces, and reliable operation across −40 °C to 100 °C are required.

Key Features

• Logic Capacity  Approximately 90,960 logic elements to implement complex digital functions and system logic.
• Embedded Memory  Approximately 4.52 Mbits of on‑chip RAM for FIFOs, buffering, and local data storage.
• I/O Density  558 user I/Os for broad peripheral, bus, and board‑level connectivity.
• Package & Mounting  1152‑BBGA package (supplier device package: 1152‑FBGA, 35×35) with surface‑mount mounting for compact board integration.
• Voltage Supply  Core supply range of 1.15 V to 1.25 V enabling low‑voltage system designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for industrial application environments.
• High‑Speed Transceiver Technology (family)  Stratix II GX family devices include high‑speed serial transceivers with clock and data recovery (CDR) and SERDES capability supporting data rates up to 6.375 Gbps; transceiver features include programmable VOD, pre‑emphasis, adaptive equalization, and dynamic reconfiguration.
• Clocking & DSP (family)  Family features include TriMatrix memory architecture, high‑speed DSP blocks (multipliers and MACs), and up to four enhanced PLLs for flexible clock management and signal processing.
• Memory Interface Support (family)  Family‑level support for high‑speed external memories including QDR/QDRII, DDR/DDR2, and SDR SDRAM for system memory interfaces.
• Design Security & Configuration (family)  Family supports configuration bitstream encryption and remote configuration updates to protect designs and enable field upgrades.

Typical Applications

• High‑Speed Communications  Use for protocol bridging, line cards, and interfaces where high‑speed serial transceivers and abundant logic resources are required.
• Backplane & Chip‑to‑Chip Interfaces  Suitable for high‑speed backplane and board‑to‑board link implementations leveraging the Stratix II GX transceiver capabilities.
• External Memory Controllers  Implement DDR/DDR2 and QDR interface logic and memory controllers using on‑chip memory and DSP resources.
• Signal Processing & Acceleration  Deploy DSP blocks and dedicated multipliers for FIR filters, multiply‑accumulate functions, and other real‑time processing tasks.

Unique Advantages

• High integration density:  Approximately 90,960 logic elements and ~4.52 Mbits of embedded RAM reduce the need for external logic and memory, simplifying board design.
• Extensive I/O capability:  558 I/Os provide flexibility for multi‑lane interfaces, parallel buses, and mixed signal domain connectivity.
• Industrial reliability:  −40 °C to 100 °C operating range and industrial grading support deployment in demanding environments.
• Advanced transceiver features (family):  Stratix II GX transceiver technologies—CDR, adaptive equalization, programmable VOD and pre‑emphasis—help maintain link integrity across high‑speed serial channels.
• Flexible clocking and DSP resources (family):  Multiple PLLs and dedicated DSP blocks enable robust clock management and high‑performance signal processing integration.
• Compact, manufacturable package:  1152‑BBGA / 1152‑FBGA (35×35) surface‑mount package supports high‑density assembly and automated PCB manufacturing.

Why Choose EP2SGX90EF1152I4?

The EP2SGX90EF1152I4 combines Stratix II GX architecture with high logic density, substantial embedded memory, and a large I/O complement to address complex, high‑bandwidth system designs. Its industrial temperature rating and surface‑mount 1152‑FBGA package make it appropriate for robust board‑level integration where performance and reliability matter.

This device is well suited for engineers building high‑speed communications links, memory interface controllers, and signal‑processing accelerators who need a configurable, high‑capacity FPGA platform backed by Stratix II GX family capabilities such as advanced transceivers, DSP resources, and flexible clocking.

Request a quote or submit an inquiry to get pricing and availability for EP2SGX90EF1152I4. Our team can provide lifecycle, lead‑time, and ordering details to support your design and procurement plans.