EP2SGX90FF1508C3N

The EP2SGX90FF1508C3N is a Stratix® II GX field‑programmable gate array in a 1508‑ball FCBGA package, designed for high‑performance, high‑density digital designs. It combines a large logic array with significant on‑chip RAM and the Stratix II GX family’s high‑speed transceiver and clocking capabilities to address demanding communication, interfacing, and protocol bridging applications.

With 90,960 logic elements, approximately 4.52 Mbits of embedded memory, and up to 650 I/O pins, this surface‑mount commercial‑grade FPGA provides the integration and I/O density needed for complex system designs while operating within a 1.15 V to 1.25 V supply range and a 0 °C to 85 °C temperature window.

Key Features

• Logic Capacity  90,960 logic elements provide large programmable fabric for complex logic, control, and data‑path implementations.
• Embedded Memory  Approximately 4.52 Mbits of on‑chip RAM (TriMatrix memory architecture in the family) to implement dual‑port memories and FIFOs for high throughput designs.
• I/O Density  Up to 650 I/O pins in a compact 1508‑BBGA (1508‑FBGA, FC 40×40) package for extensive external interface connectivity.
• High‑speed Transceiver Family Features  Stratix II GX family transceivers support 600 Mbps to 6.375 Gbps full‑duplex operation with clock and data recovery (CDR), embedded SERDES, and dynamic reconfiguration capability.
• Clocking and PLLs  Family architecture includes multiple global and regional clock networks and up to four enhanced PLLs for flexible clocking, spread spectrum, and phase control.
• DSP Capabilities  Family DSP blocks support dedicated multipliers and multiply‑accumulate functions suitable for high‑performance signal processing tasks.
• Power and Mounting  Surface‑mount FCBGA package with a nominal supply voltage range of 1.15 V to 1.25 V to match system power rails.
• Operating Range and Compliance  Commercial grade operation from 0 °C to 85 °C; RoHS‑compliant manufacturing.

Typical Applications

• High‑speed Communications  Use in backplane and protocol bridging designs where family transceiver capabilities (up to 6.375 Gbps per channel) are required for serial links and media interfaces.
• Chip‑to‑Chip Interconnect  High I/O count and dense logic fabric enable complex chip‑to‑chip protocol handling and data aggregation tasks.
• Network and Packet Processing  Large logic capacity, embedded memory, and DSP resources support packet buffering, queuing, and real‑time processing functions.
• High‑Performance Interface Controllers  Implement DDR/QDR memory interfaces and source‑synchronous buses using the device’s I/O density and family memory support.

Unique Advantages

• High Logic Density: 90,960 logic elements permit implementation of large, multi‑module systems on a single FPGA, reducing board count and complexity.
• Substantial On‑Chip Memory: Approximately 4.52 Mbits of embedded RAM enables local buffering and high‑speed data handling without external memory for many functions.
• Extensive I/O Reach: 650 I/Os in a 1508‑ball FCBGA enable broad peripheral and high‑pin‑count interconnects, simplifying system routing and integration.
• Family‑Level High‑Speed SerDes: Stratix II GX transceiver capabilities support a wide range of serial protocols and data rates for flexible link design.
• Flexible Clocking and DSP Support: Multiple clock networks, enhanced PLLs, and dedicated DSP blocks provide deterministic timing and high‑throughput signal processing options.
• Commercial‑Grade, RoHS‑Compliant: Designed for commercial temperature ranges and RoHS‑compliant manufacturing for broad deployment.

Why Choose EP2SGX90FF1508C3N?

The EP2SGX90FF1508C3N brings Stratix II GX family capabilities into a high‑capacity FPGA package suited for designs that demand dense logic, abundant on‑chip memory, and extensive I/O. Its combination of 90,960 logic elements, approximately 4.52 Mbits of embedded RAM, and the family’s high‑speed transceiver and clocking features makes it well matched to communications, interface bridging, and high‑performance processing tasks.

This device benefits teams seeking a scalable, high‑integration FPGA solution supported by Stratix II GX family documentation and feature set—providing a clear path for system integration, prototyping, and deployment where commercial‑grade temperature and RoHS compliance are required.

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