EP2SGX90FF1508C5

IC FPGA 650 I/O 1508FBGA
Part Description

Stratix® II GX Field Programmable Gate Array (FPGA) IC 650 4520448 90960 1508-BBGA, FCBGA

Quantity 166 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1508-FBGA, FC (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1508-BBGA, FCBGANumber of I/O650Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4548Number of Logic Elements/Cells90960
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4520448

Overview of EP2SGX90FF1508C5 – Stratix® II GX FPGA, 1508-BBGA

The EP2SGX90FF1508C5 is a Stratix® II GX field-programmable gate array (FPGA) IC from Intel, delivered in a 1508-BBGA FCBGA surface-mount package. It pairs a large, scalable logic array with the Stratix II GX architecture for designs that require significant programmable logic, embedded memory, and extensive I/O.

With 90,960 logic elements, approximately 4.52 Mbits of embedded memory, and 650 I/O pins, this device targets high-performance applications such as high-speed backplane interfaces, chip-to-chip bridging, and communications system integration while operating from a 1.15 V–1.25 V core supply.

Key Features

  • Logic Capacity  Provides 90,960 logic elements to implement complex digital logic, control, and protocol processing.
  • Embedded Memory  Approximately 4.52 Mbits of on-chip RAM suitable for FIFOs, buffering, and large on-chip data storage.
  • I/O Density  650 I/O pins support dense board-level connectivity for parallel buses, peripherals, and multi-channel interfaces.
  • Stratix II GX Architecture  Includes family-level features such as high-speed serial transceivers with clock and data recovery (CDR) and SERDES capability enabling serial data rates up to 6.375 Gbps per channel.
  • Configurable Transceiver Features  Family-level transceiver attributes include dynamic VOD and pre-emphasis, selectable on-chip termination, adaptive equalization, and power-down control for link management.
  • Clocking and DSP  Stratix II GX architecture supports multiple global and regional clock networks plus high-speed DSP block capabilities for arithmetic-intensive functions (as described in the Stratix II GX device documentation).
  • Package and Mount  1508-BBGA (FCBGA) surface-mount package; supplier device package listed as 1508-FBGA, FC (40×40).
  • Power and Temperature  Core voltage range 1.15 V to 1.25 V; commercial grade operation from 0 °C to 85 °C.
  • Standards and Compliance  RoHS-compliant device.

Typical Applications

  • High-speed Networking  Implements protocol bridging, packet processing, and serializer/deserializer tasks using the Stratix II GX transceiver capabilities and dense logic fabric.
  • Backplane and Board-level Interconnect  Supports high-throughput backplane interfaces and chip-to-chip links with abundant I/O and embedded memory for buffering and alignment.
  • Communications Equipment  Suitable for designs requiring configurable serial links and on-chip DSP/multiplier resources for signal processing functions.
  • Memory Interface and Buffering  On-chip RAM and wide I/O enable implementation of external-memory controllers, FIFOs, and data-path buffering in complex systems.

Unique Advantages

  • Large Programmable Fabric:  90,960 logic elements provide headroom for complex state machines, protocol stacks, and custom accelerators.
  • Significant Embedded Memory:  Approximately 4.52 Mbits of on-chip RAM reduces external memory dependence for buffering and real-time data handling.
  • High I/O Count:  650 I/O pins simplify integration of wide parallel interfaces and multiple high-speed channels on a single device.
  • High-speed Serial Capability (Series-level):  Stratix II GX transceiver technology supports CDR and SERDES up to 6.375 Gbps per channel, enabling modern serial protocols and link speeds.
  • Commercial Temperature Range:  Rated for 0 °C to 85 °C operation to align with commercial product requirements.
  • RoHS Compliant:  Meets environmental regulations for lead-free assembly and shipment.

Why Choose EP2SGX90FF1508C5?

The EP2SGX90FF1508C5 combines a high-capacity logic array, substantial embedded memory, and a dense I/O complement in a 1508-BBGA package to support demanding digital designs. As part of the Stratix II GX family, it leverages proven architecture features—such as high-speed transceivers, flexible clocking, and DSP resources—making it well suited for high-throughput communications, backplane, and system-bridging applications.

This device is a practical choice for engineering teams seeking a commercially graded FPGA with significant on-chip resources, integration flexibility, and compliance with RoHS requirements. Its supply voltage range and operating temperature profile support standard commercial deployments while enabling scalable, reprogrammable system designs.

Request a quote or submit an inquiry to purchase EP2SGX90FF1508C5 and evaluate how this Stratix® II GX FPGA fits your next high-performance design.

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