EP2SGX90FF1508C5
| Part Description |
Stratix® II GX Field Programmable Gate Array (FPGA) IC 650 4520448 90960 1508-BBGA, FCBGA |
|---|---|
| Quantity | 166 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1508-FBGA, FC (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1508-BBGA, FCBGA | Number of I/O | 650 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4548 | Number of Logic Elements/Cells | 90960 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4520448 |
Overview of EP2SGX90FF1508C5 – Stratix® II GX FPGA, 1508-BBGA
The EP2SGX90FF1508C5 is a Stratix® II GX field-programmable gate array (FPGA) IC from Intel, delivered in a 1508-BBGA FCBGA surface-mount package. It pairs a large, scalable logic array with the Stratix II GX architecture for designs that require significant programmable logic, embedded memory, and extensive I/O.
With 90,960 logic elements, approximately 4.52 Mbits of embedded memory, and 650 I/O pins, this device targets high-performance applications such as high-speed backplane interfaces, chip-to-chip bridging, and communications system integration while operating from a 1.15 V–1.25 V core supply.
Key Features
- Logic Capacity Provides 90,960 logic elements to implement complex digital logic, control, and protocol processing.
- Embedded Memory Approximately 4.52 Mbits of on-chip RAM suitable for FIFOs, buffering, and large on-chip data storage.
- I/O Density 650 I/O pins support dense board-level connectivity for parallel buses, peripherals, and multi-channel interfaces.
- Stratix II GX Architecture Includes family-level features such as high-speed serial transceivers with clock and data recovery (CDR) and SERDES capability enabling serial data rates up to 6.375 Gbps per channel.
- Configurable Transceiver Features Family-level transceiver attributes include dynamic VOD and pre-emphasis, selectable on-chip termination, adaptive equalization, and power-down control for link management.
- Clocking and DSP Stratix II GX architecture supports multiple global and regional clock networks plus high-speed DSP block capabilities for arithmetic-intensive functions (as described in the Stratix II GX device documentation).
- Package and Mount 1508-BBGA (FCBGA) surface-mount package; supplier device package listed as 1508-FBGA, FC (40×40).
- Power and Temperature Core voltage range 1.15 V to 1.25 V; commercial grade operation from 0 °C to 85 °C.
- Standards and Compliance RoHS-compliant device.
Typical Applications
- High-speed Networking Implements protocol bridging, packet processing, and serializer/deserializer tasks using the Stratix II GX transceiver capabilities and dense logic fabric.
- Backplane and Board-level Interconnect Supports high-throughput backplane interfaces and chip-to-chip links with abundant I/O and embedded memory for buffering and alignment.
- Communications Equipment Suitable for designs requiring configurable serial links and on-chip DSP/multiplier resources for signal processing functions.
- Memory Interface and Buffering On-chip RAM and wide I/O enable implementation of external-memory controllers, FIFOs, and data-path buffering in complex systems.
Unique Advantages
- Large Programmable Fabric: 90,960 logic elements provide headroom for complex state machines, protocol stacks, and custom accelerators.
- Significant Embedded Memory: Approximately 4.52 Mbits of on-chip RAM reduces external memory dependence for buffering and real-time data handling.
- High I/O Count: 650 I/O pins simplify integration of wide parallel interfaces and multiple high-speed channels on a single device.
- High-speed Serial Capability (Series-level): Stratix II GX transceiver technology supports CDR and SERDES up to 6.375 Gbps per channel, enabling modern serial protocols and link speeds.
- Commercial Temperature Range: Rated for 0 °C to 85 °C operation to align with commercial product requirements.
- RoHS Compliant: Meets environmental regulations for lead-free assembly and shipment.
Why Choose EP2SGX90FF1508C5?
The EP2SGX90FF1508C5 combines a high-capacity logic array, substantial embedded memory, and a dense I/O complement in a 1508-BBGA package to support demanding digital designs. As part of the Stratix II GX family, it leverages proven architecture features—such as high-speed transceivers, flexible clocking, and DSP resources—making it well suited for high-throughput communications, backplane, and system-bridging applications.
This device is a practical choice for engineering teams seeking a commercially graded FPGA with significant on-chip resources, integration flexibility, and compliance with RoHS requirements. Its supply voltage range and operating temperature profile support standard commercial deployments while enabling scalable, reprogrammable system designs.
Request a quote or submit an inquiry to purchase EP2SGX90FF1508C5 and evaluate how this Stratix® II GX FPGA fits your next high-performance design.

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