EP3C10E144A7N

The EP3C10E144A7N is a Cyclone® III field programmable gate array (FPGA) designed for low-power, high-functionality applications. As a member of the Cyclone III family, it targets high-volume, cost- and power-sensitive designs and provides a balance of logic, embedded memory, I/O capacity, and automotive-grade operating range.

This device is specified for a supply voltage range of 1.15 V to 1.25 V and an operating temperature range of −40 °C to 125 °C, with AEC-Q100 qualification and RoHS compliance for demanding environments and automotive applications.

Key Features

• Logic Capacity — 10,320 logic elements provide a compact programmable fabric for mid-range integration and logic consolidation.
• Embedded Memory — 423,936 bits of on-chip RAM (approximately 0.42 Mbits) for buffering, state storage, and small data tables.
• I/O and Packaging — 94 user I/Os in a 144-LQFP exposed-pad package; supplier device package listed as 144-EQFP (20×20) for PCB footprint planning.
• Automotive Qualification — AEC-Q100 qualification and a −40 °C to 125 °C operating range support automotive system deployment.
• Low-Voltage Operation — Core supply range of 1.15 V to 1.25 V to meet low-power design requirements.
• Family-Level Power and Integration — Based on TSMC low-power process technology and Cyclone III architecture focused on minimizing static power for thermally constrained and battery-powered systems.
• RoHS Compliant — Conforms to RoHS directives for material compliance in modern electronics manufacturing.

Typical Applications

• Automotive Electronics — Suitable for body electronics, domain controllers, and in-vehicle processing where AEC-Q100 qualification and extended temperature range are required.
• Low-Power Embedded Systems — Fits battery-powered or thermally constrained devices that need programmable logic with minimized static power.
• High-Volume Consumer and Industrial Designs — Targets cost-sensitive, high-volume products requiring mid-range logic and integrated memory to reduce BOM complexity.
• Sensor and Interface Aggregation — Provides logic and I/O capacity for sensor fusion, protocol bridging, and custom interface functions.

Unique Advantages

• Balanced Logic and Memory: 10,320 logic elements and approximately 0.42 Mbits of embedded RAM enable consolidated functions without excessive external resources.
• Automotive-Ready: AEC-Q100 qualification combined with a −40 °C to 125 °C range supports deployment in automotive environments.
• Low-Power Foundation: Built on a low-power process and Cyclone III family optimizations to help meet tight power budgets in portable and thermally constrained systems.
• Compact, PCB-Friendly Package: 144-LQFP exposed-pad package (supplier 144-EQFP 20×20) simplifies thermal management and board layout for space-constrained designs.
• Good I/O Density: 94 I/Os provide flexible interface options for mixed-signal and multi-peripheral systems.
• Regulatory and Manufacturing Compatibility: RoHS compliance eases integration into modern manufacturing flows.

Why Choose EP3C10E144A7N?

The EP3C10E144A7N delivers a practical balance of programmable logic, embedded memory, and I/O capacity within an automotive-qualified Cyclone III FPGA package. Its low-voltage core and family-level low-power optimizations make it well suited for designs that require reduced power dissipation without sacrificing integration.

Choose this device when you need a mid-density FPGA for automotive or high-volume embedded applications where temperature, qualification, and compact packaging are decisive factors. The Cyclone III family heritage provides a predictable platform for scalability and integration into established design flows.

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