EP3C10E144C8N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 94 423936 10320 144-LQFP Exposed Pad |
|---|---|
| Quantity | 295 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 94 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 645 | Number of Logic Elements/Cells | 10320 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP3C10E144C8N – Cyclone® III Field Programmable Gate Array (FPGA) IC 94 423936 10320 144-LQFP Exposed Pad
The EP3C10E144C8N is a Cyclone® III FPGA offering a balance of high functionality, low power and cost-efficiency for volume, cost-sensitive designs. Built on the Cyclone III device family architecture, it delivers 10,320 logic elements, approximately 0.42 Mbits of embedded memory and 94 user I/Os in a compact 144-LQFP exposed pad package.
Targeted at commercial applications, this device supports low-power operation and dense I/O integration for portable and cost-critical systems that require flexible logic, embedded memory and robust clocking options.
Key Features
- Logic Capacity — 10,320 logic elements for implementing mid-range programmable logic functions and custom digital architectures.
- Embedded Memory — Approximately 0.42 Mbits of on-chip RAM to support buffering, FIFOs and small data stores without external memory.
- I/O Count & Standards — 94 user I/Os to accommodate multiple peripheral interfaces and board-level connectivity in I/O-constrained designs.
- Low-Power Family Architecture — Part of the Cyclone III family built on a TSMC low-power process; designed to reduce static power for battery‑sensitive or thermally constrained applications.
- Clock Management — Cyclone III family supports multiple PLLs for robust clock generation and synthesis (features available per family documentation).
- Power Supply — Core voltage range of 1.15 V to 1.25 V, enabling power-optimized system designs.
- Package & Mounting — Surface-mount 144-LQFP exposed pad package (20 × 20 mm supplier device package) for compact PCB implementation and thermal performance.
- Commercial Grade & Temperature — Rated for commercial operation from 0 °C to 85 °C and RoHS compliant.
Typical Applications
- Portable and Handheld Devices — Low-power Cyclone III architecture and modest logic density help extend battery life in portable instrumentation and consumer handhelds.
- Consumer Electronics — Cost-sensitive, high-volume products that need flexible logic and on-chip memory for feature integration and protocol handling.
- Communications and Interface Bridging — High I/O count and programmable logic are well-suited for protocol conversion, I/O expansion and interface glue logic.
- Embedded Control and Processing — On-chip memory and logic fabric support custom control engines, state machines and embedded processing tasks.
Unique Advantages
- Balanced Performance and Efficiency: Combines 10,320 logic elements with a low-power device family to meet mid-range logic needs while keeping static power low.
- Integrated Memory for Smaller BOM: Approximately 0.42 Mbits of embedded RAM reduces the need for external memory in many buffering and small-data applications.
- Flexible I/O Density: 94 I/Os provide ample connectivity for multi-peripheral designs without resorting to larger, more expensive packages.
- Compact, Thermally-Aware Package: 144-LQFP exposed pad packaging supports surface-mount assembly and helps with board-level thermal transfer.
- Commercial Ready and RoHS Compliant: Rated for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial product deployment.
- Supported Cyclone III Ecosystem: Part of the Cyclone III family that includes pre-built IP and embedded processor options to accelerate development (refer to family documentation for available IP and tools).
Why Choose EP3C10E144C8N?
The EP3C10E144C8N positions itself as a practical, mid-range Cyclone III FPGA option for designers who need a combination of programmable logic, embedded memory and substantial I/O in a commercial-grade, surface-mount package. Its power-optimized family architecture, combined with 10,320 logic elements and approximately 0.42 Mbits of on-chip RAM, makes it suitable for volume, cost-sensitive applications where efficiency and integration matter.
Designers benefit from the Cyclone III ecosystem and family-level features such as multiple PLLs and available IP, enabling faster time-to-market and scalable migration paths within the Cyclone III lineup.
Request a quote or submit an inquiry for availability and pricing to get EP3C10E144C8N integrated into your next design.

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