EP3C10F256A7N

The EP3C10F256A7N is a Cyclone® III family FPGA offering a balanced mix of programmable logic, embedded memory, and I/O density for cost- and power-sensitive designs. Built on the Cyclone III architecture, it targets applications that require moderate logic capacity, efficient power profiles, and robust system integration.

This device provides 10,320 logic elements across 645 CLBs, approximately 0.42 Mbits of embedded memory, and 182 user I/Os in a compact 256-ball BGA package, making it suitable for integrated control, interface, and mixed-signal support within constrained system footprints.

Key Features

• Core Logic  645 CLBs and 10,320 logic elements provide programmable logic resources for glue logic, state machines, and custom acceleration.
• Embedded Memory  Approximately 0.42 Mbits of on-chip RAM to support FIFOs, buffering, and small data tables without external memory.
• I/O Resources  182 user I/Os enable high pin-count interfacing for sensors, buses, and peripheral connectivity.
• Power and Voltage  Operates from a 1.15 V to 1.25 V core supply and benefits from the Cyclone III family emphasis on low-power operation.
• Automotive Qualification  Automotive grade device qualified to AEC-Q100 and specified for operation from -40 °C to 125 °C.
• Package & Mounting  256-LBGA package (supplier device package: 256-FBGA, 17×17) designed for surface-mount assembly in compact designs.
• Family Integration  As a Cyclone III device, the family provides features for system integration such as clock management and pre-verified IP cores (family-level characteristics).

Typical Applications

• Automotive Control Systems  AEC-Q100 qualification and a -40 °C to 125 °C range make the device suitable for in-vehicle control, gateway logic, and sensor preprocessing.
• Portable and Battery-Powered Electronics  Cyclone III family low-power characteristics support longer battery life and minimized thermal management for handheld applications.
• Interface and I/O Bridging  High I/O count (182 I/Os) enables protocol translation, bus bridging, and multi-peripheral interfacing in compact boards.
• Embedded Control and Signal Processing  10,320 logic elements and on-chip memory provide resources for control logic, finite-state machines, and modest data buffering tasks.

Unique Advantages

• Moderate Logic Capacity:  10,320 logic elements deliver the programmability required for mid-range integration without excessive cost or board area.
• Automotive-Ready:  AEC-Q100 qualification and extended temperature rating support deployment in automotive environments.
• High I/O Flexibility:  182 user I/Os allow dense peripheral connectivity and flexible board-level routing.
• Compact BGA Package:  256-LBGA (256-FBGA, 17×17) minimizes PCB footprint while enabling high signal density.
• Low-Voltage Core Operation:  1.15 V to 1.25 V supply range supports power-optimized system designs.
• Family-Level System Features:  Cyclone III family architecture provides design options for clock management and pre-built IP to accelerate development.

Why Choose EP3C10F256A7N?

The EP3C10F256A7N positions itself as a practical FPGA choice when you need a balance of programmable logic, embedded memory, and a high I/O count in a compact, automotive-qualified package. Its Cyclone III family heritage brings low-power design considerations and system-level features that help reduce BOM complexity and speed design integration.

This device is well suited for engineers developing mid-range embedded control, interface aggregation, and automotive logic functions who require verified operating ranges, AEC-Q100 qualification, and a compact BGA footprint for space-constrained PCBs.

Request a quote or submit an inquiry for pricing and availability to evaluate the EP3C10F256A7N for your next design.