EP3C10F256C6

The EP3C10F256C6 is a Cyclone® III field programmable gate array (FPGA) IC optimized for low-power, cost-sensitive applications. It integrates 10,320 logic elements with approximately 0.42 Mbits of embedded memory and up to 182 user I/Os in a compact 256-LBGA surface-mount package.

Designed for high-volume and low-power systems, this commercial-grade Cyclone III device delivers a balance of logic capacity, on-chip memory, and I/O density for control, signal interfacing, and mid-range programmable-logic tasks.

Key Features

• Logic Capacity — 10,320 logic elements to implement combinational and sequential logic functions for mid-range FPGA designs.
• Embedded Memory — Approximately 0.42 Mbits of on-chip RAM to support buffering, lookup tables, and data storage without external memory.
• I/O Count — 182 user I/Os providing broad interface options for sensors, peripherals, and system buses.
• Low‑Power Family Characteristics — Based on Cyclone III device family features that emphasize low power and efficiency for battery-powered and thermally constrained applications.
• Clock Management — Cyclone III family architecture includes multiple phase-locked loops (PLLs) for flexible clock synthesis and management (family-level feature).
• Supply Voltage — Core supply range from 1.15 V to 1.25 V to match system power domains.
• Package & Mounting — 256-LBGA package (supplier package: 256-FBGA, 17×17) with surface-mount mounting for compact PCB integration.
• Temperature & Grade — Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Consumer Electronics — Low-power programmable logic for portable and handheld devices where battery life and integration matter.
• Embedded Control — Motor control, protocol bridging, and interface logic that require moderate logic density and substantial I/O.
• Communications & I/O Aggregation — Signal conditioning, I/O expansion and protocol conversion using the device’s high I/O count and on-chip memory.
• System Prototyping — Rapid development of mid-range FPGA designs leveraging pre-built IP and the Cyclone III device family architecture.

Unique Advantages

• Balanced Logic-to-Memory Ratio: 10,320 logic elements paired with approximately 0.42 Mbits of embedded RAM provides a practical balance for control and data-path functions without immediate need for external memory.
• High I/O Density: 182 user I/Os enable robust peripheral and sensor interfacing while minimizing the need for additional I/O expanders.
• Compact Surface-Mount Package: 256-LBGA (256-FBGA, 17×17) supports space-constrained board designs while preserving routability and signal integrity.
• Low-Power Design Heritage: As a Cyclone III family device, it benefits from low-power process and architecture choices that help reduce system power consumption.
• Flexible Clock Management (Family Feature): On-device PLL resources available in the Cyclone III family offer flexible clocking options for mixed-frequency systems.
• Compliance and Supply Compatibility: Commercial-grade temperature range and RoHS compliance simplify integration into consumer and industrial-commercial products with standard supply domains (1.15–1.25 V core).

Why Choose EP3C10F256C6?

The EP3C10F256C6 delivers a well-rounded mid-range FPGA solution for designers who need moderate logic capacity, substantial I/O, and embedded RAM in a low-power Cyclone III platform. Its commercial-grade specification, compact 256-LBGA package, and family-level features such as low-power operation and flexible clock resources make it a practical choice for consumer electronics, embedded control, and communication interface applications.

Backed by the Cyclone III device family ecosystem and available family-level IP, the EP3C10F256C6 is suited to teams looking to balance cost, power, and integration while leveraging pre-validated design flows and cores.

Request a quote or submit an inquiry to receive pricing and availability for the EP3C10F256C6 and support for integrating this Cyclone III FPGA into your next design.