EP3C10F256C8

IC FPGA 182 I/O 256FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 10320 256-LBGA

Quantity 449 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O182Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs645Number of Logic Elements/Cells10320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP3C10F256C8 – Cyclone® III Field Programmable Gate Array (FPGA) IC, 10,320 logic elements, 182 I/O, 256-LBGA

The EP3C10F256C8 is a Cyclone® III family FPGA providing 10,320 logic elements in a compact 256-LBGA package. As a member of the Cyclone III family, it targets cost- and power-sensitive applications that require a balance of logic capacity, embedded memory, and flexible I/O resources.

Designed for commercial-grade applications, this device combines a low-voltage core (1.15–1.25 V), 182 user I/Os, and approximately 0.4 Mbits of embedded memory to support mid-range custom logic, interface bridging, and embedded-processing use cases.

Key Features

  • Core Logic  10,320 logic elements provide mid-range programmable logic capacity for custom datapaths, control logic, and glue functions.
  • Logic Array Blocks (LABs)  645 LABs to structure logic resources and simplify hierarchical design partitioning.
  • Embedded Memory  Approximately 0.4 Mbits (423,936 bits) of on-chip RAM to support buffers, FIFOs, and small on-chip storage.
  • I/O Count & Flexibility  182 user I/Os enable broad interface support and parallel connectivity for sensors, buses, and external devices.
  • Clock Management  Cyclone III family devices include multiple PLLs for clock synthesis and distribution (family-level feature).
  • Low-Voltage Core  Core operating voltage 1.15 V to 1.25 V to match low-power system rails.
  • Package & Mounting  256-LBGA package, surface-mount, compact footprint suitable for dense PCB layouts (supplier package listed as 256-FBGA, 17×17).
  • Operating Range  Commercial temperature range: 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

  • Portable and Handheld Devices  Low-power family architecture and reduced static power make the device suitable for battery-powered and thermally constrained designs.
  • Consumer and High-Volume Electronics  Cost-sensitive Cyclone III family positioning supports mid-range logic and memory requirements in consumer products.
  • Embedded Control and Processing  On-chip memory and programmable logic support control, protocol handling, and integration with soft-core processors available in the Cyclone III ecosystem.
  • I/O-Intensive Interfaces  182 user I/Os enable bridging, bus interfacing, and parallel sensor/actuator connectivity in system designs.

Unique Advantages

  • Balanced Logic and Memory: 10,320 logic elements paired with approximately 0.4 Mbits of embedded RAM deliver a practical mix of resources for mid-range designs.
  • Extensive I/O Count: 182 user I/Os provide the flexibility to connect multiple external devices and implement parallel or mixed-signal interfaces.
  • Low-Voltage Operation: 1.15–1.25 V core supply reduces power budget impact and aligns with low-power system architectures.
  • Compact, PCB-Friendly Package: 256-LBGA (256-FBGA 17×17 supplier package) supports dense board layouts while keeping the footprint compact.
  • Commercial-Grade Reliability: Rated for 0 °C to 85 °C and RoHS compliant for mainstream commercial applications and manufacturing flows.
  • Access to Cyclone III Ecosystem: As part of the Cyclone III family, the device benefits from family-level design features and pre-built IP resources for faster development.

Why Choose EP3C10F256C8?

The EP3C10F256C8 offers a thoughtfully balanced FPGA option for engineers who need mid-range programmable logic, meaningful embedded memory, and a high I/O count in a compact package. Its low-voltage core and Cyclone III family architecture make it well suited to cost- and power-sensitive commercial applications where integration and board-level density matter.

For design teams targeting portable products, consumer electronics, or embedded control systems, EP3C10F256C8 provides a dependable mix of resources and ecosystem support to accelerate development while keeping system BOM and power consumption in check.

Request a quote or submit a pricing request to evaluate EP3C10F256C8 for your next design and confirm availability and lead time.

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