EP3C10M164C7N

The EP3C10M164C7N is a Cyclone® III series Field Programmable Gate Array (FPGA) supplied in a 164-TFBGA package for surface-mount assembly. It provides 10,320 logic elements and on-chip memory tailored for cost-sensitive, low-power applications that require flexible programmable logic and moderate I/O integration.

Built on the Cyclone III device family architecture, this device targets high-volume embedded designs where low-power operation, configurable logic, and compact packaging are primary design drivers.

Key Features

• Logic Capacity  10,320 logic elements to implement glue logic, state machines, and moderate-complexity custom logic functions.
• Embedded Memory  423,936 bits of on-chip RAM (approximately 0.42 Mbits) for FIFOs, buffers, and small data stores.
• IO Count and Packaging  106 user I/O pins in a 164-TFBGA (supplier package: 164-MBGA, 8×8) surface-mount package for compact board layouts.
• Supply Voltage  Core supply range of 1.15 V to 1.25 V to match platform power rails and enable low-power operation.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C suitable for consumer and industrial-adjacent environments.
• Power and Integration (Family-level)  Cyclone III family characteristics emphasize low-power operation and system integration, helping reduce overall power budget in embedded systems.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Consumer Electronics  Implement peripheral control, display interfacing, and custom data handling in compact, battery- or adapter-powered devices.
• Communications and Networking  Provide protocol bridging, packet buffering, and I/O adaption where moderate logic density and on-chip memory are required.
• Embedded Control  Perform motor-control glue logic, sensor aggregation, and state-machine-based control functions for embedded products.
• Instrumentation and Test Equipment  Add flexible digital processing, timing control, and custom interfaces in benchtop and rack-mounted instruments operating within commercial temperature ranges.

Unique Advantages

• Right-sized Logic and Memory: 10,320 logic elements with approximately 0.42 Mbits of embedded RAM balance resource availability and cost for mid-range designs.
• Compact, Surface-Mount Package: 164-TFBGA (164-MBGA, 8×8) package minimizes PCB area while providing ample I/O for peripheral interfacing.
• Low-Power Family Characteristics: Cyclone III family design emphasis on low-power operation supports reduced system power consumption.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C, appropriate for consumer and many commercial embedded applications.
• Clear Supply and Compliance: Defined core voltage range (1.15 V–1.25 V) and RoHS compliance simplify system power planning and regulatory readiness.

Why Choose EP3C10M164C7N?

The EP3C10M164C7N delivers a practical combination of programmable logic capacity, embedded memory, and I/O in a compact surface-mount package suitable for volume-conscious designs. Its Cyclone III family heritage emphasizes low-power operation and system integration, making it a fit for developers needing moderate logic resources without excess cost or board area.

This device is ideal for engineers building consumer, communications, and embedded-control products that require flexible, reprogrammable logic, defined supply and thermal envelopes, and RoHS-compliant manufacturing.

Request a quote or submit an inquiry to receive pricing and availability for EP3C10M164C7N. Our team can provide lead-time details and support for volume procurement and design integration.