EP3C10M164C8N

IC FPGA 106 I/O 164MBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 106 423936 10320 164-TFBGA

Quantity 407 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package164-MBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case164-TFBGANumber of I/O106Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs645Number of Logic Elements/Cells10320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP3C10M164C8N – Cyclone® III FPGA, 10,320 logic elements, ~0.42 Mbits RAM, 106 I/O, 164-TFBGA

The EP3C10M164C8N is a Cyclone® III family field programmable gate array (FPGA) in a 164-TFBGA package designed for commercial applications. It combines 10,320 logic elements with approximately 0.42 Mbits of embedded memory and 106 user I/Os to support mid-range integration and system control functions.

Built on the Cyclone III device family architecture, this device targets cost-sensitive, low-power, and high-volume designs that require moderate logic capacity, compact packaging, and flexible I/O connectivity.

Key Features

  • Logic Capacity — 10,320 logic elements provide mid-range programmable logic for control, sequencing, and glue-logic tasks.
  • Embedded Memory — Approximately 0.42 Mbits of on-chip RAM for FIFOs, buffering, and small lookup tables.
  • User I/O — 106 general-purpose I/O pins suitable for connecting sensors, buses, interfaces, and peripherals.
  • Clock Management — Cyclone III family architecture includes up to four PLLs per device for flexible clock synthesis and distribution.
  • Power — Low-voltage core operation with a supply range of 1.15 V to 1.25 V, supporting power-conscious designs.
  • Package and Mounting — 164-TFBGA (supplier package 164-MBGA 8×8), surface-mount package for compact PCB integration.
  • Operating Grade — Commercial temperature range from 0 °C to 85 °C for general-purpose applications.
  • Standards and Ecosystem — Part of the Cyclone III family, which provides device-level features such as low-power process optimizations and a library of family IP cores and development support.
  • Compliance — RoHS-compliant manufacturing.

Typical Applications

  • Consumer and Portable Electronics — Implement user interfaces, peripheral aggregation, and protocol bridging while keeping power and board area constrained.
  • Embedded Control Systems — Implement sequencing, state machines, and custom control logic using the device’s logic elements and on-chip RAM.
  • Data Acquisition and Sensor Hubs — Aggregate sensor inputs and pre-process data with available I/O and embedded memory for buffering.
  • Prototyping and Proof-of-Concept — Mid-range logic capacity and accessible I/Os make it suitable for hardware validation and functional prototyping.

Unique Advantages

  • Compact, mid-range logic — 10,320 logic elements deliver substantial combinational and sequential resources in a small package, reducing board area and BOM complexity.
  • On-chip memory for buffering — Approximately 0.42 Mbits of embedded RAM supports FIFOs, frame buffers, and local data storage without external memory.
  • Flexible I/O pinout — 106 user I/Os enable multiple peripheral connections and interface options from a single device.
  • Low-voltage core — 1.15 V to 1.25 V supply range supports designs with strict power budgets.
  • Commercial temperature rating — 0 °C to 85 °C operation suits a wide range of indoor and ambient-temperature deployments.
  • Family-level support — Access to Cyclone III device family IP and development resources helps accelerate design implementation and migration.

Why Choose EP3C10M164C8N?

The EP3C10M164C8N balances mid-range programmable logic, embedded memory, and ample I/O in a compact 164-TFBGA surface-mount package, making it a practical choice for commercial applications that require moderate integration without unnecessary complexity. Its Cyclone III family heritage offers low-power process optimizations and a supportive ecosystem of IP and development tools, helping shorten time-to-market.

This device is well suited for engineers and procurement teams building consumer electronics, embedded controllers, and data-aggregation modules that demand reliable performance within a commercial temperature range and RoHS-compliant manufacturing.

Request a quote or submit an inquiry to get pricing, lead-time, and availability for the EP3C10M164C8N. Provide your required quantity and delivery timeline to receive a tailored response.

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