EP3C10U256C6N

The EP3C10U256C6N is a Cyclone® III family FPGA from Intel offering 10,320 logic elements and approximately 0.424 Mbits of embedded memory in a 256-ball LFBGA package. Designed for commercial applications, this surface-mount device provides 182 user I/Os, a 1.15 V–1.25 V core supply range, and an operating temperature range of 0 °C to 85 °C.

As a member of the Cyclone III device family, the part targets low-power, cost-sensitive designs that require flexible I/O, on-chip memory, and programmable logic integration for compact system designs.

Key Features

• Logic Capacity — 10,320 logic elements to implement glue logic, state machines, and moderate-density custom logic functions.
• Embedded Memory — Approximately 0.424 Mbits of on-chip RAM for FIFOs, buffers, and small data storage requirements.
• I/O Count & Flexibility — 182 user I/Os to support a wide range of external peripherals and interfaces; adjustable I/O characteristics are supported by the Cyclone III family.
• Low-Voltage Core — Core supply range of 1.15 V to 1.25 V to match modern low-voltage systems and minimize power consumption.
• Clock Management — Cyclone III family devices include multiple PLLs for clock synthesis and distribution to support diverse timing architectures.
• Package & Mounting — 256-LFBGA (listed as 256-UBGA 14×14) surface-mount package for compact PCB integration.
• Operating Range — Commercial temperature rating from 0 °C to 85 °C suitable for most business and consumer applications.
• RoHS Compliant — Environmentally compliant for lead-free manufacturing and assembly processes.

Typical Applications

• Consumer Electronics — Implement display controllers, protocol bridging, and custom peripheral logic where compact, low-power programmable logic is required.
• Communications Equipment — Provide flexible I/O routing, protocol adaptation, and packet buffering using on-chip RAM and logic elements.
• Instrumentation & Test — Realize custom signal processing, data buffering, and control logic for test fixtures and measurement systems.
• Embedded Control — Integrate control state machines, timing logic, and peripheral interfaces in compact embedded controllers for commercial products.

Unique Advantages

• Balanced Logic and Memory — 10,320 logic elements combined with ~0.424 Mbits of embedded RAM enables practical integration of control logic and on-chip data storage to reduce external memory needs.
• High I/O Density — 182 I/Os allow direct interfacing to sensors, connectors, and high-pin-count peripherals without extensive external glue logic.
• Compact Surface-Mount Package — 256-LFBGA (14×14 UBGA) offers a small PCB footprint while retaining ample I/O and routing resources for space-constrained designs.
• Low-Voltage Operation — 1.15 V–1.25 V core supply supports integration in modern low-power systems and helps reduce overall power draw.
• Commercial Temperature Rating — 0 °C to 85 °C operating range aligns with a broad set of business and consumer product environments.
• Regulatory Readiness — RoHS compliance supports lead-free manufacturing and global environmental requirements.

Why Choose EP3C10U256C6N?

The EP3C10U256C6N positions itself as a cost-effective, low-power FPGA option within the Cyclone III family for commercial designs that need a balance of logic capacity, embedded memory, and flexible I/O. Its combination of 10,320 logic elements, approximately 0.424 Mbits of on-chip RAM, and 182 I/Os in a compact 256-LFBGA package makes it well-suited for system integration tasks where board space and power are constrained.

Choose this device when you need a commercially rated, RoHS-compliant FPGA that supports a broad range of embedded control, communication, and consumer applications while leveraging the Cyclone III family’s clock management and low-power design characteristics.

Request a quote or submit your bill-of-materials to get pricing and availability for EP3C10U256C6N. Our team will respond with lead times and purchasing options tailored to your project requirements.