EP3C10U256C8

The EP3C10U256C8 is a Cyclone III family FPGA offering a balance of moderate logic capacity, on-chip memory, and extensive I/O in a compact 256‑LFBGA package. Designed for low-power, cost-sensitive applications, this device targets designs that require flexible programmable logic, substantial I/O, and integrated clock management.

As a Cyclone III device, it benefits from low-power process optimizations and family-level features such as embedded memory, PLLs for clock synthesis, and a collection of pre-built IP cores to accelerate system integration and development.

Key Features

• Logic Capacity — 10,320 logic elements for implementing custom combinational and sequential logic functions.
• Embedded Memory — Approximately 0.42 Mbits (423,936 bits) of on-chip RAM to support buffers, FIFOs, and other memory-intensive functions.
• I/O Resources — 182 user I/O pins to support multiple interfaces and board-level connectivity in I/O-constrained designs.
• Clock Management — Family-level support for four phase-locked loops (PLLs) to provide clock synthesis and robust clock-domain control.
• Power and Supply — Core voltage supply range of 1.15 V to 1.25 V consistent with low-power operation.
• Package and Mounting — 256‑LFBGA (256‑UBGA, 14×14) surface‑mount package for compact PCB integration.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental — RoHS compliant for environmental and regulatory conformance.

Typical Applications

• Portable and Battery‑Powered Devices — Low-power Cyclone III operation and narrow core voltage range help extend battery life in handheld and portable systems.
• Consumer and Communications Equipment — Moderate logic density and substantial I/O enable protocol bridging, interface handling, and custom peripherals in consumer and comms products.
• Embedded Control and Processing — On-chip RAM and available IP cores support embedded control functions, custom accelerators, and soft processor integration.
• I/O-Intensive Subsystems — 182 user I/Os and family support for a wide range of I/O standards make the device suitable for board-level interface aggregation and signal conditioning.

Unique Advantages

• Balanced Logic and Memory: 10,320 logic elements paired with approximately 0.42 Mbits of embedded RAM provide the resources needed for mid-range custom logic and buffering without excessive BOM complexity.
• High I/O Density: 182 I/Os support multi-protocol interfacing and reduce the need for external I/O expanders, simplifying PCB routing.
• Compact BGA Footprint: 256‑LFBGA (14×14) package enables dense board layouts while preserving routing efficiency for high-pin-count designs.
• Low-Power Family Design: Cyclone III family optimizations and a 1.15–1.25 V core supply help minimize static power for cost-sensitive and thermally constrained applications.
• Robust Clocking: Four PLLs per device provide flexible clock synthesis and domain management to simplify timing architectures.
• Regulatory and Development Support: RoHS compliance and access to a library of pre-built, verified IP cores help accelerate development and regulatory planning.

Why Choose EP3C10U256C8?

The EP3C10U256C8 delivers a practical combination of logic capacity, embedded memory, and high I/O count in a compact 256‑LFBGA package, making it well suited for designers targeting low-power, cost-sensitive systems that still require significant I/O and clock management. Its commercial temperature range and RoHS compliance align with standard consumer and communications product requirements.

Backed by Cyclone III family design features—including low-power process optimizations, integrated PLLs, and a library of verified IP cores—this device provides a scalable platform for mid-range FPGA applications where integration, power efficiency, and development velocity are important.

Request a quote or submit an inquiry to receive pricing and availability for EP3C10U256C8 and to discuss how this device can fit into your next design.