EP3C10U256I7

The EP3C10U256I7 is a Cyclone III family Field Programmable Gate Array (FPGA) optimized for low-power, high-functionality designs. This industrial-grade device integrates 10,320 logic elements, approximately 0.424 Mbits of embedded memory, and 182 user I/Os in a compact 256-LFBGA surface-mount package.

Designed for high-volume, cost- and power-sensitive applications, the Cyclone III architecture delivers system integration and flexible I/O capability while operating from a low core supply (1.15 V to 1.25 V) across an extended industrial temperature range (−40 °C to 100 °C).

Key Features

• Logic Capacity  10,320 logic elements provide the programmable fabric required for moderate-density logic and custom digital functions.
• Embedded Memory  Approximately 0.424 Mbits of on-chip RAM for buffering, FIFOs, and small lookup tables.
• I/O Count & Flexibility  182 user I/Os to support a wide range of peripherals and external interfaces; Cyclone III family devices support multiple I/O standards and adjustable slew rates to help with signal integrity.
• Power & Voltage  Low-voltage core operation at 1.15 V to 1.25 V, benefiting low-power system designs consistent with the Cyclone III low-power process.
• Clocking & Timing  Cyclone III family devices provide robust clock management, including multiple phase-locked loops (PLLs) with reconfiguration capability for system clock synthesis and I/O timing control.
• Package & Mounting  Surface-mount 256-LFBGA (supplier package 256-UBGA, 14×14) for compact board-level integration.
• Operating Range  Industrial temperature rating from −40 °C to 100 °C for deployment in thermally demanding environments.
• Compliance  RoHS compliant to support environmentally regulated designs.

Typical Applications

• Industrial Control  Deterministic logic, I/O aggregation, and timing functions for motor control, PLCs, and factory automation within industrial temperature ranges.
• Embedded Systems  Custom peripheral interfacing and moderate-complexity processing for embedded platforms where low power and compact packaging are required.
• I/O-Constrained Designs  High I/O count and flexible I/O standards support applications that require dense interfacing to sensors, converters, or external controllers.
• Low-Power, High-Volume Products  Ideal for consumer or portable products and other high-volume deployments that prioritize low static power and cost-effective FPGA integration.

Unique Advantages

• Highly integrated programmable fabric: 10,320 logic elements and on-chip memory reduce external component count and simplify board design.
• Low-voltage, low-power operation: 1.15–1.25 V core supply combined with Cyclone III low-power process characteristics helps minimize system power consumption.
• Flexible I/O and clocking: 182 I/Os and Cyclone III clock-management features enable diverse interface options and precise timing control.
• Industrial temperature capability: −40 °C to 100 °C rating supports deployment in harsh or thermally challenging environments.
• Compact BGA package: 256-LFBGA (14×14 UBGA) saves PCB area while providing robust soldered mounting for production assemblies.
• Regulatory alignment: RoHS compliance helps meet environmental standards for modern electronic products.

Why Choose EP3C10U256I7?

The EP3C10U256I7 brings Cyclone III family capabilities to designs that require a balance of programmable logic density, embedded memory, and flexible I/O in an industrial-grade package. Its low-voltage operation, compact 256-LFBGA footprint, and extended temperature range make it well suited for embedded and industrial applications where power efficiency, integration, and environmental robustness are important.

For engineers building cost- and power-conscious systems, this device offers a near-term solution with the Cyclone III ecosystem of clocking, I/O standards support, and on-chip resources that simplify system architecture and reduce BOM complexity.

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