EP3C10U256C8N

The EP3C10U256C8N is a Cyclone® III family FPGA offering 10,320 logic elements, approximately 0.42 Mbits of embedded memory (423,936 bits), and 182 user I/Os in a 256-LFBGA (256-UBGA, 14×14) package. It targets cost- and power-sensitive designs that require moderate logic density, flexible I/O, and on-chip memory for glue logic, protocol bridging, and control functions.

Built on the Cyclone III device family architecture, the device emphasizes low power and integration, providing designers with programmable logic, embedded memory, and I/O flexibility for a broad set of embedded and communication-oriented applications.

Key Features

• Logic Capacity — 10,320 logic elements suitable for mid-range FPGA designs and custom digital logic implementations.
• Embedded Memory — Approximately 0.42 Mbits of on-chip RAM (423,936 bits) for buffers, FIFOs, and small data stores.
• I/O Resources — 182 user I/Os to support multiple parallel interfaces and mixed-signal front-end connections.
• Power Supply — Core voltage range of 1.15 V to 1.25 V, aligning with Cyclone III low-power operation characteristics.
• Package and Mounting — 256-LFBGA (supplier package: 256-UBGA, 14×14) in a surface-mount form factor for compact PCB layouts.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for standard embedded and consumer environments.
• Device Family Capabilities — Leverages Cyclone III family features such as low-power process optimizations, multiple PLLs for clock management, and support for a wide collection of I/O standards (family-level capability described in the Cyclone III device handbook).
• Standards and Compliance — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Embedded Control and Glue Logic — Implement custom control state machines, protocol conversion, and peripheral interfacing using the device's logic elements and on-chip memory.
• Communications Interfaces — Support multi-protocol interface logic and parallel I/O aggregation with 182 I/Os for bridging and signal routing tasks.
• Consumer and Industrial OEM Electronics — Enable cost-sensitive product features such as user interface handling, sensor aggregation, and timing-critical control in commercial-temperature systems.
• Prototyping and Custom IP Integration — Deploy verified IP blocks or small embedded processors from the Cyclone III ecosystem to accelerate development of bespoke digital subsystems.

Unique Advantages

• Balanced Mid-Range Capacity — 10,320 logic elements with substantial I/O density deliver the right balance of resources for moderate-complexity designs without excess cost.
• On-Chip Memory for Local Storage — Approximately 0.42 Mbits of embedded RAM reduces the need for external memory for many buffering and control tasks, simplifying BOM and PCB routing.
• High I/O Count — 182 user I/Os enable support for multiple parallel interfaces and mixed-signal front-ends, making the device suitable for interface-dense applications.
• Low-Power Family Design — As part of the Cyclone III family, the device benefits from low-power process optimizations and device-level features aimed at reducing static power consumption.
• Compact, Surface-Mount Package — 256-LFBGA (14×14 UBGA) enables compact board designs while maintaining a high pin count for flexible system connectivity.
• Commercial-Grade Temperature Range — Rated for 0 °C to 85 °C operation to meet standard commercial and many embedded application requirements.

Why Choose EP3C10U256C8N?

The EP3C10U256C8N positions itself as a practical, cost-conscious FPGA option within the Cyclone III family—offering mid-range logic capacity, meaningful embedded memory, and a high I/O count in a compact surface-mount BGA package. It is well-suited for designers who need programmable logic and interface flexibility for consumer, industrial, and embedded applications operating in commercial temperature ranges.

Choosing this part provides a scalable path for designs that leverage the Cyclone III family’s low-power focus and ecosystem of IP and tools, helping reduce development time and component count while maintaining verifiable, on-chip resources for control, buffering, and protocol handling.

Request a quote or submit an inquiry to check availability, pricing, and lead times for EP3C10U256C8N. Our team can provide procurement options and volume guidance to support your project schedule.