EP3C120F484C7N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 283 3981312 119088 484-BGA |
|---|---|
| Quantity | 1,434 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 283 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7443 | Number of Logic Elements/Cells | 119088 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3981312 |
Overview of EP3C120F484C7N – Cyclone® III Field Programmable Gate Array (484-BGA)
The EP3C120F484C7N is a Cyclone III family FPGA offering high integration and low-power operation for cost-sensitive, high-volume digital designs. It combines a large programmable fabric with substantial on-chip memory and a high I/O count in a compact 484-ball FBGA package.
Targeted at applications that require a balance of performance, power efficiency, and system integration, this device is well suited to embedded processing, portable/handheld systems, and I/O‑rich designs that benefit from on-chip memory and flexible clocking options.
Key Features
- Logic Capacity — 119,088 logic elements provide substantial programmable logic for complex designs.
- Embedded Memory — Approximately 3.98 Mbits of on-chip RAM to support buffering, FIFOs, and embedded data storage.
- I/O Density — 283 user I/O pins to support extensive peripheral and interface connectivity.
- Clocking — Cyclone III family devices include up to four phase-locked loops (PLLs) per device with five outputs per PLL for flexible clock management and synthesis.
- Low-Power Technology — Built on TSMC low-power (LP) process technology and silicon optimizations to minimize static power consumption for battery-powered and thermally constrained designs.
- I/O Flexibility — Family-level support for a wide range of I/O standards and adjustable I/O slew rates to improve signal integrity; on-chip termination calibration (OCT) is supported to compensate for PVT variations.
- Package and Mounting — 484-FBGA (23×23) surface-mount package (484-BGA) for compact board layouts.
- Supply and Temperature — Core supply range 1.15 V to 1.25 V; commercial operating range 0 °C to 85 °C.
- Compliance — RoHS compliant.
Typical Applications
- Portable and Handheld Devices — Low-power silicon and modest static power profile help extend battery life in portable electronics and handheld instruments.
- Consumer Electronics (High-volume) — Cost-sensitive, high-volume products that require programmable logic and on-chip memory for feature integration and BOM reduction.
- Embedded Processing and System Integration — On-chip RAM and support for Nios II (Cyclone III family feature) enable compact embedded processing subsystems without large external memories.
- I/O-Rich Interfaces — High I/O count and flexible I/O standards support complex interface bridging, protocol handling, and sensor/peripheral integration.
Unique Advantages
- High Logic and Memory Integration: 119,088 logic elements with approximately 3.98 Mbits of embedded memory reduce reliance on external components and simplify board design.
- Balanced Power and Performance: TSMC low-power process and Cyclone III low-power design approach enable efficient operation in thermally constrained or battery-powered systems.
- Flexible Clocking: Multiple PLLs with multiple outputs per PLL provide robust clock management for diverse subsystems and interface requirements.
- Extensive I/O Capability: 283 I/Os and support for many I/O standards allow direct interfacing to a wide range of peripherals and high-speed links.
- Compact Packaging: 484-FBGA (23×23) package delivers high density in a board-friendly footprint for space-constrained designs.
- Proven Ecosystem: Part of the Cyclone III family, which is supported by family tools and pre-built IP workflows to accelerate development.
Why Choose EP3C120F484C7N?
The EP3C120F484C7N positions itself as a versatile, low-power FPGA option within the Cyclone III family, combining a large logic fabric, several megabits of embedded memory, and a high I/O count in a compact 484-FBGA package. It is suited for designers seeking a balanced solution for embedded processing, I/O-rich systems, and cost-sensitive, high-volume products.
Choosing this device provides a pathway to scalable designs within the Cyclone III family and leverages the family-level capabilities—low-power process, flexible I/O, clocking resources, and a supported development ecosystem—for reliable, integrable system designs.
Request a quote or submit your RFQ to obtain pricing and availability for the EP3C120F484C7N.

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