EP3C10U256I7N

The EP3C10U256I7N is an industrial-grade Cyclone® III field-programmable gate array (FPGA) in a 256-LFBGA package designed for low-power, cost-sensitive system designs. Built on the Cyclone III device family, it delivers a balanced mix of logic, I/O, and embedded memory for applications that require moderate logic density with a compact surface-mount form factor.

With 10,320 logic elements, 182 user I/Os, and approximately 0.424 Mbits of embedded memory, this device targets high-volume embedded systems, industrial controls, and connectivity-oriented designs where power efficiency, integration, and predictable operating ranges are important.

Key Features

• Logic Capacity — 10,320 logic elements organized across 645 CLBs for implementing medium-complexity logic and control functions.
• Embedded Memory — Approximately 0.424 Mbits (423,936 bits) of on-chip RAM to support buffering, state machines, and small data stores without external memory.
• I/O — 182 user I/Os suitable for interfacing to multiple peripherals, sensors, and communication buses in compact systems.
• Power Supply — Core voltage range of 1.15 V to 1.25 V to support low-power system designs.
• Package & Mounting — 256-LFBGA (supplier package: 256-UBGA, 14×14 mm) in a surface-mount form factor for space-constrained PCBs.
• Industrial Temperature Grade — Specified to operate from −40 °C to 100 °C for reliable operation in a wide range of industrial environments.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free manufacturing.
• Cyclone III Family Characteristics — As a Cyclone III device family member, benefits include low-power process technology and device-level features (family-level documentation references four PLLs per device, configurable I/O standards, and other system integration capabilities).

Typical Applications

• Industrial Control — Deterministic logic and ample I/O count for motor control, PLC interfaces, and factory automation subsystems that require extended temperature range.
• Embedded Processing — Medium-density programmable logic for glue logic, protocol bridging, and custom accelerators in compact embedded platforms.
• Communication Interfaces — Flexible I/O resources to implement custom serial interfaces, protocol converters, or peripheral aggregation in networking and instrumentation equipment.

Unique Advantages

• Balanced Integration: Combines 10,320 logic elements, embedded RAM, and 182 I/Os in a single compact package to reduce external components and simplify board layout.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, supporting deployment in thermally varied industrial environments.
• Low-Power Core Voltage: Narrow 1.15 V–1.25 V core range helps system-level power budgeting for battery-powered or thermally sensitive designs.
• Compact Surface-Mount Package: 256-LFBGA (14×14 mm UBGA footprint) enables high-density PCB designs while maintaining robust thermal and electrical performance.
• Standards-Compliant Manufacturing: RoHS compliance supports lead-free assembly and environmental regulatory requirements.

Why Choose EP3C10U256I7N?

The EP3C10U256I7N is positioned for designers who need a practical balance of logic capacity, I/O density, and on-chip memory within an industrial temperature envelope. Its Cyclone III family heritage brings low-power process benefits and device-level features that streamline integration into cost-sensitive, space-constrained products.

This device is well suited for customers developing industrial controls, embedded processing modules, and communications interfaces where predictable thermal and electrical specifications, a compact BGA package, and RoHS compliance are required.

Request a quote or submit your specifications to receive pricing and availability for EP3C10U256I7N. Our team can help evaluate fit for your design and provide procurement options.