EP3C120F484C8N

The EP3C120F484C8N is a Cyclone® III series Field Programmable Gate Array (FPGA) in a 484‑ball BGA package, delivering a high-density logic fabric for cost- and power-sensitive designs. With 119,088 logic elements and approximately 3.98 Mbits of embedded memory, it is built for applications requiring substantial on-chip logic, memory and I/O connectivity within a commercial-grade temperature range.

Designed around Cyclone III family architecture and TSMC low-power process technology, this device targets high-volume, low-power consumer and embedded systems where integration, I/O count and efficient power usage matter.

Key Features

• Core capacity  119,088 logic elements provide a large programmable fabric for complex logic, state machines and custom accelerators.
• Embedded memory  Approximately 3.98 Mbits of on-chip RAM for buffering, FIFOs and tightly coupled data storage.
• I/O density  283 user I/Os support extensive peripheral and bus interfacing without external expander logic.
• Clock management  Cyclone III family devices include multiple phase-locked loops (PLLs) for flexible clock synthesis and distribution.
• Low-power architecture  Based on TSMC low-power process technology and silicon optimizations to reduce static and dynamic power for battery-powered and thermally constrained designs.
• Power supply  Core voltage operation from 1.15 V to 1.25 V to match modern low-voltage system rails.
• Package and mounting  484‑FBGA (23×23) surface-mount package provides a compact footprint for board-level integration.
• Commercial temperature grade  Specified for 0 °C to 85 °C operation for standard commercial applications.
• RoHS compliant  Conforms to RoHS requirements for lead‑free assembly and environmental compliance.

Typical Applications

• Battery-powered portable devices  Low-power process technology and efficient logic/memory integration help extend battery life in compact handheld systems.
• Consumer electronics  High logic density and abundant I/Os enable user-interface control, video/audio pre-processing and connectivity functions.
• Embedded control and automation  On-chip memory and large logic capacity support real-time control, protocol bridging and custom state machines.
• High-volume, cost-sensitive designs  Cyclone III family characteristics make the device suitable where device cost, power and integration need to be balanced.

Unique Advantages

• High programmable capacity: 119,088 logic elements enable complex logic implementations without immediate need for multiple chips, reducing BOM complexity.
• Integrated memory: Approximately 3.98 Mbits of embedded RAM lowers external memory dependence and improves data throughput for latency-sensitive tasks.
• Extensive I/O: 283 user I/Os simplify board-level routing for multi-peripheral systems and reduce external interface components.
• Low-voltage core operation: 1.15–1.25 V supply supports modern low-voltage system designs and helps minimize power dissipation.
• Compact BGA package: 484‑FBGA (23×23) balances board area and thermal considerations for space-constrained products.
• Compliance and grade: RoHS compliance and commercial temperature rating align with mainstream consumer and embedded product requirements.

Why Choose EP3C120F484C8N?

The EP3C120F484C8N positions itself as a high-capacity Cyclone III FPGA option for designers who need significant on-chip logic, memory and I/O in a compact, low-power package. It is well-suited for commercial embedded systems, consumer devices and high-volume applications where integration and power efficiency are priorities.

Backed by Cyclone III family architecture and manufacturing optimizations, this device delivers a balance of programmable density, clock management capabilities and board-level integration that supports scalable designs and long-term product plans.

Request a quote or submit a pricing inquiry to check availability and bring EP3C120F484C8N into your next design cycle.