EP3C120F780C7

The EP3C120F780C7 is a Cyclone® III family FPGA optimized for low-power, high-functionality designs. It integrates a large programmable fabric with 119,088 logic elements, substantial embedded memory, and a high I/O count to address cost-sensitive, high-volume applications that require flexible logic, custom peripherals, and dense I/O integration.

Built on the Cyclone III device architecture, this device delivers family-level features such as low-power process optimizations, on-chip clock management and memory resources, and support for a wide range of I/O standards—making it suitable for embedded systems, communications interfaces, and system control applications within the commercial temperature range.

Key Features

• Programmable Logic  119,088 logic elements provide substantial capacity for complex custom logic, glue logic, and soft-IP implementations.
• Embedded Memory  Approximately 3.98 Mbits of on-chip RAM supports FIFOs, buffers, and local data storage without external memory.
• High I/O Count  531 general-purpose I/O pins enable dense peripheral interfacing and multi-channel connectivity for board-level integration.
• Low-Power Design  Cyclone III family low-power process technology and power-aware design flow reduce static power consumption; device supply voltage is 1.15 V to 1.25 V.
• Clock Management  Family features include advanced PLL-based clock management (four PLLs per device with multiple outputs) to synthesize and distribute clocks for I/O and core logic.
• I/O Standards & Signal Integrity  Family-level support for many I/O standards and adjustable I/O slew rates help meet signal-integrity and interface requirements across common bus and serial standards.
• Package & Mounting  780-FBGA package (29 × 29 mm), surface-mount, delivering a compact high-pin-count footprint for dense PCB designs.
• Commercial Grade & Temperature Range  Rated for commercial operation from 0 °C to 85 °C and RoHS-compliant for environmental compatibility.

Typical Applications

• Embedded Processing & Custom Peripherals  Implement soft processors and tailored accelerators using the device’s logic capacity and on-chip memory to reduce external component count.
• High‑Density I/O Bridging  Leverage 531 I/Os for protocol bridging, multi-channel sensor or interface aggregation, and board-level glue logic where many signals must be routed and processed.
• Low‑Power, Cost‑Sensitive Systems  Use the Cyclone III low-power characteristics and modest supply voltage for portable or thermally constrained products that require efficient FPGA integration.
• Clock‑Critical Designs  Take advantage of the device’s PLLs and clock-management features to generate and distribute multiple clock domains for communication and processing subsystems.

Unique Advantages

• High Logic Capacity: 119,088 logic elements enable large, integrated designs and reduce the need for multiple discrete logic devices.
• Substantial On‑Chip Memory: Approximately 3.98 Mbits of embedded RAM allows local buffering and data-handling without immediate reliance on external memory.
• Extensive I/O Resources: 531 I/Os provide flexibility for complex interfacing, reducing board-level routing complexity and external interface chips.
• Low-Power Family Architecture: Built on TSMC low-power process technology and a power-aware design flow to help meet tight power budgets in commercial applications.
• Flexible Clocking: On-chip PLL resources and dynamic clock capabilities simplify multi-domain clocking and timing management.
• Compact, High‑Pin‑Count Package: 780-FBGA (29 × 29 mm) offers a space-efficient solution for high-pin-count FPGA requirements in surface-mount form.

Why Choose EP3C120F780C7?

The EP3C120F780C7 positions itself as a high-capacity, low-power Cyclone III FPGA suitable for designers who need significant logic and memory in a single, commercially graded device. With abundant I/O, on-chip RAM, and family-proven clock and power optimizations, it simplifies integration for embedded processing, high-density interfacing, and cost-sensitive product lines.

Supported by the Cyclone III device ecosystem and development flows, this device provides a scalable path for projects that require robust logic integration, flexible clocking, and a compact BGA footprint—helping teams reduce BOM complexity and accelerate system-level designs.

Request a quote or submit a purchasing inquiry to receive pricing and availability information for EP3C120F780C7. Our team will assist with lead times, volume pricing, and any technical details you require to evaluate this FPGA for your design.