EP3C120F780C8N

IC FPGA 531 I/O 780FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 531 3981312 119088 780-BGA

Quantity 1,488 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BGANumber of I/O531Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7443Number of Logic Elements/Cells119088
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3981312

Overview of EP3C120F780C8N – Cyclone® III Field Programmable Gate Array (FPGA) IC 531 3981312 119088 780-BGA

The EP3C120F780C8N is a Cyclone III family FPGA designed for low-power, high-functionality applications. It combines a large logic fabric with substantial on-chip memory and a high I/O count in a compact 780-ball BGA package, making it well suited to cost- and power-sensitive designs.

Typical use cases include consumer, communications, and general embedded systems that require flexible logic implementation, significant embedded RAM, and a broad set of I/O options while operating within commercial temperature limits.

Key Features

  • Core Logic  119,088 logic elements provide substantial programmable logic capacity for complex combinational and sequential designs.
  • Embedded Memory  Approximately 3.98 Mbits of on-chip RAM for data buffering, FIFOs, and on-chip storage.
  • I/O Resources  531 user I/Os support high external connectivity requirements and flexible system interfacing.
  • Clock Management  Cyclone III family clock features include four PLLs per device with five outputs per PLL; PLLs are cascaded and dynamically reconfigurable to support flexible clocking schemes.
  • Low-Power Architecture  Built on the Cyclone III low-power family design, optimized for reduced static and dynamic power consumption.
  • Voltage and Mounting  Operates from a 1.15 V to 1.25 V core supply and is supplied in a 780-FBGA (29×29) surface-mount package for compact board-level integration.
  • Operating Range  Commercial operating temperature range of 0 °C to 85 °C to match standard commercial deployments.
  • Standards and System Features  Cyclone III family devices support a wide collection of I/O standards and on-chip features such as OCT calibration and dedicated CRC checker circuitry for system reliability (family-level features documented in the Cyclone III Device Handbook).
  • RoHS Compliant  Device is RoHS compliant, meeting common environmental requirements for lead-free assembly.

Typical Applications

  • Consumer and Portable Devices  Flexible logic and low-power operation enable feature-rich user interfaces, signal processing, and peripheral control while conserving power.
  • Communications Equipment  High I/O count and robust clocking support interface bridging, protocol handling, and data buffering in mid-range communications systems.
  • Embedded Control Systems  Large logic capacity and on-chip RAM make the device suitable for embedded control, custom accelerators, and real-time processing tasks.
  • Data Acquisition and Instrumentation  Multiple I/Os and embedded memory provide the resources needed for sensor aggregation, preprocessing, and temporary storage.

Unique Advantages

  • High Logic Density: 119,088 logic elements allow integration of complex functions on a single device, reducing board-level component count.
  • Significant On-Chip RAM: Approximately 3.98 Mbits of embedded memory reduces external memory requirements for buffering and data handling.
  • Extensive I/O Capacity: 531 I/Os enable broad interfacing options for multi-channel systems and high pin-count peripherals.
  • Integrated Clocking: Four PLLs with multiple outputs and dynamic reconfiguration support flexible clock generation and system timing architectures.
  • Compact Package: 780-FBGA (29×29) surface-mount package delivers a high-pin-count solution in a compact board footprint.
  • Regulatory Compliance: RoHS compliance supports lead-free assembly and helps meet environmental requirements.

Why Choose EP3C120F780C8N?

The EP3C120F780C8N positions itself as a high-capacity, low-power Cyclone III FPGA option where substantial logic, on-chip memory, and a large I/O set are required within a commercial temperature range. Its combination of logic density, embedded RAM, and integrated clocking capabilities supports consolidation of multiple functions into a single device, simplifying designs and reducing BOM complexity.

This device is appropriate for designers targeting mid-range embedded and communications applications that value power efficiency, integration, and flexible I/O in a compact BGA package, backed by the Cyclone III family feature set and documentation.

Request a quote or submit a quotation request to obtain pricing and lead-time information for the EP3C120F780C8N.

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