EP3C120F780C8N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 531 3981312 119088 780-BGA |
|---|---|
| Quantity | 1,488 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BGA | Number of I/O | 531 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7443 | Number of Logic Elements/Cells | 119088 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3981312 |
Overview of EP3C120F780C8N – Cyclone® III Field Programmable Gate Array (FPGA) IC 531 3981312 119088 780-BGA
The EP3C120F780C8N is a Cyclone III family FPGA designed for low-power, high-functionality applications. It combines a large logic fabric with substantial on-chip memory and a high I/O count in a compact 780-ball BGA package, making it well suited to cost- and power-sensitive designs.
Typical use cases include consumer, communications, and general embedded systems that require flexible logic implementation, significant embedded RAM, and a broad set of I/O options while operating within commercial temperature limits.
Key Features
- Core Logic 119,088 logic elements provide substantial programmable logic capacity for complex combinational and sequential designs.
- Embedded Memory Approximately 3.98 Mbits of on-chip RAM for data buffering, FIFOs, and on-chip storage.
- I/O Resources 531 user I/Os support high external connectivity requirements and flexible system interfacing.
- Clock Management Cyclone III family clock features include four PLLs per device with five outputs per PLL; PLLs are cascaded and dynamically reconfigurable to support flexible clocking schemes.
- Low-Power Architecture Built on the Cyclone III low-power family design, optimized for reduced static and dynamic power consumption.
- Voltage and Mounting Operates from a 1.15 V to 1.25 V core supply and is supplied in a 780-FBGA (29×29) surface-mount package for compact board-level integration.
- Operating Range Commercial operating temperature range of 0 °C to 85 °C to match standard commercial deployments.
- Standards and System Features Cyclone III family devices support a wide collection of I/O standards and on-chip features such as OCT calibration and dedicated CRC checker circuitry for system reliability (family-level features documented in the Cyclone III Device Handbook).
- RoHS Compliant Device is RoHS compliant, meeting common environmental requirements for lead-free assembly.
Typical Applications
- Consumer and Portable Devices Flexible logic and low-power operation enable feature-rich user interfaces, signal processing, and peripheral control while conserving power.
- Communications Equipment High I/O count and robust clocking support interface bridging, protocol handling, and data buffering in mid-range communications systems.
- Embedded Control Systems Large logic capacity and on-chip RAM make the device suitable for embedded control, custom accelerators, and real-time processing tasks.
- Data Acquisition and Instrumentation Multiple I/Os and embedded memory provide the resources needed for sensor aggregation, preprocessing, and temporary storage.
Unique Advantages
- High Logic Density: 119,088 logic elements allow integration of complex functions on a single device, reducing board-level component count.
- Significant On-Chip RAM: Approximately 3.98 Mbits of embedded memory reduces external memory requirements for buffering and data handling.
- Extensive I/O Capacity: 531 I/Os enable broad interfacing options for multi-channel systems and high pin-count peripherals.
- Integrated Clocking: Four PLLs with multiple outputs and dynamic reconfiguration support flexible clock generation and system timing architectures.
- Compact Package: 780-FBGA (29×29) surface-mount package delivers a high-pin-count solution in a compact board footprint.
- Regulatory Compliance: RoHS compliance supports lead-free assembly and helps meet environmental requirements.
Why Choose EP3C120F780C8N?
The EP3C120F780C8N positions itself as a high-capacity, low-power Cyclone III FPGA option where substantial logic, on-chip memory, and a large I/O set are required within a commercial temperature range. Its combination of logic density, embedded RAM, and integrated clocking capabilities supports consolidation of multiple functions into a single device, simplifying designs and reducing BOM complexity.
This device is appropriate for designers targeting mid-range embedded and communications applications that value power efficiency, integration, and flexible I/O in a compact BGA package, backed by the Cyclone III family feature set and documentation.
Request a quote or submit a quotation request to obtain pricing and lead-time information for the EP3C120F780C8N.

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