EP3C120F780I7N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 531 3981312 119088 780-BGA |
|---|---|
| Quantity | 399 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BGA | Number of I/O | 531 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7443 | Number of Logic Elements/Cells | 119088 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3981312 |
Overview of EP3C120F780I7N – Cyclone® III FPGA, 119,088 logic elements, 780-BGA
The EP3C120F780I7N is an Intel Cyclone® III field programmable gate array (FPGA) in a 780-ball BGA package. It combines high logic density with embedded memory and a broad I/O count to address system integration needs in cost- and power-sensitive designs.
Built on the Cyclone III device family architecture, this device targets applications requiring substantial programmable logic (119,088 logic elements), approximately 3.98 Mbits of embedded memory, and flexible I/O (531 pins) while operating across a wide industrial temperature range.
Key Features
- Core logic capacity — 119,088 logic elements provide ample programmable resources for medium- to high-density logic integration and custom processing tasks.
- Embedded memory — Approximately 3.98 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory for many functions.
- High I/O count — 531 user I/O pins to interface directly with sensors, peripherals, high-speed buses, and mixed-signal front ends.
- Low-power family architecture — Cyclone III family design emphasizes low power operation through TSMC low-power process technology and device/flow optimizations for reduced static power consumption.
- Clock management — Family-level clock resources include multiple phase-locked loops (PLLs) for robust clock synthesis and distribution across system domains.
- Voltage and thermal — Core voltage range of 1.15 V to 1.25 V and industrial operating temperature range of −40 °C to 100 °C for harsh-environment operation.
- Package and mounting — 780-ball FBGA (29 × 29 mm) surface-mount package suitable for compact PCB designs requiring high pin density.
- Standards and I/O flexibility — Family support for a broad set of I/O standards and adjustable slew rates to improve signal integrity across interfaces.
- Compliance — RoHS-compliant device for environmental regulatory alignment.
Typical Applications
- Portable and battery-powered equipment — Low-power architecture helps extend battery life for handheld devices and portable instrumentation.
- Communications and networking — Large logic capacity, extensive I/O, and PLL-based clocking for protocol handling, packet processing, and interface bridging.
- Industrial control and automation — Industrial temperature rating and high I/O count enable sensor aggregation, motor control logic, and real-time control functions.
- Consumer and multimedia devices — Embedded memory and configurable logic for custom user interfaces, video preprocessing, and glue logic between subsystems.
Unique Advantages
- Substantial programmable density: 119,088 logic elements let you consolidate multiple discrete functions into a single FPGA, reducing BOM and board complexity.
- Embedded memory integration: Approximately 3.98 Mbits of on-chip RAM minimizes dependence on external memory for many buffering and data-path tasks.
- Broad I/O connectivity: 531 I/Os enable direct interfacing to numerous peripherals and high-pin-count interfaces without additional multiplexing logic.
- Designed for low-power operation: Cyclone III family optimizations help meet power budgets for thermally constrained and battery-operated systems.
- Industrial-grade operation: Rated from −40 °C to 100 °C, suitable for many industrial environments where extended temperature tolerance is required.
- High-density BGA packaging: 780-FBGA (29 × 29 mm) provides the pin count needed for complex systems while keeping PCB area efficient.
Why Choose EP3C120F780I7N?
The EP3C120F780I7N positions itself as a practical choice for designers who need a balance of high programmable logic capacity, substantial on-chip memory, and a wide complement of I/O in a single, RoHS-compliant FPGA package. Its Cyclone III family heritage brings low-power operation and system-level clocking flexibility to designs that must meet cost, power, and integration targets.
This device is suitable for engineers building industrial, communications, portable, and consumer systems who require a durable, well-specified FPGA platform with vendor-provided device features and design flow support for scalable implementations.
Request a quote or submit an inquiry to receive pricing and availability for the EP3C120F780I7N.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018