EP3C120F780I7N

IC FPGA 531 I/O 780FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 531 3981312 119088 780-BGA

Quantity 399 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BGANumber of I/O531Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7443Number of Logic Elements/Cells119088
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3981312

Overview of EP3C120F780I7N – Cyclone® III FPGA, 119,088 logic elements, 780-BGA

The EP3C120F780I7N is an Intel Cyclone® III field programmable gate array (FPGA) in a 780-ball BGA package. It combines high logic density with embedded memory and a broad I/O count to address system integration needs in cost- and power-sensitive designs.

Built on the Cyclone III device family architecture, this device targets applications requiring substantial programmable logic (119,088 logic elements), approximately 3.98 Mbits of embedded memory, and flexible I/O (531 pins) while operating across a wide industrial temperature range.

Key Features

  • Core logic capacity — 119,088 logic elements provide ample programmable resources for medium- to high-density logic integration and custom processing tasks.
  • Embedded memory — Approximately 3.98 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory for many functions.
  • High I/O count — 531 user I/O pins to interface directly with sensors, peripherals, high-speed buses, and mixed-signal front ends.
  • Low-power family architecture — Cyclone III family design emphasizes low power operation through TSMC low-power process technology and device/flow optimizations for reduced static power consumption.
  • Clock management — Family-level clock resources include multiple phase-locked loops (PLLs) for robust clock synthesis and distribution across system domains.
  • Voltage and thermal — Core voltage range of 1.15 V to 1.25 V and industrial operating temperature range of −40 °C to 100 °C for harsh-environment operation.
  • Package and mounting — 780-ball FBGA (29 × 29 mm) surface-mount package suitable for compact PCB designs requiring high pin density.
  • Standards and I/O flexibility — Family support for a broad set of I/O standards and adjustable slew rates to improve signal integrity across interfaces.
  • Compliance — RoHS-compliant device for environmental regulatory alignment.

Typical Applications

  • Portable and battery-powered equipment — Low-power architecture helps extend battery life for handheld devices and portable instrumentation.
  • Communications and networking — Large logic capacity, extensive I/O, and PLL-based clocking for protocol handling, packet processing, and interface bridging.
  • Industrial control and automation — Industrial temperature rating and high I/O count enable sensor aggregation, motor control logic, and real-time control functions.
  • Consumer and multimedia devices — Embedded memory and configurable logic for custom user interfaces, video preprocessing, and glue logic between subsystems.

Unique Advantages

  • Substantial programmable density: 119,088 logic elements let you consolidate multiple discrete functions into a single FPGA, reducing BOM and board complexity.
  • Embedded memory integration: Approximately 3.98 Mbits of on-chip RAM minimizes dependence on external memory for many buffering and data-path tasks.
  • Broad I/O connectivity: 531 I/Os enable direct interfacing to numerous peripherals and high-pin-count interfaces without additional multiplexing logic.
  • Designed for low-power operation: Cyclone III family optimizations help meet power budgets for thermally constrained and battery-operated systems.
  • Industrial-grade operation: Rated from −40 °C to 100 °C, suitable for many industrial environments where extended temperature tolerance is required.
  • High-density BGA packaging: 780-FBGA (29 × 29 mm) provides the pin count needed for complex systems while keeping PCB area efficient.

Why Choose EP3C120F780I7N?

The EP3C120F780I7N positions itself as a practical choice for designers who need a balance of high programmable logic capacity, substantial on-chip memory, and a wide complement of I/O in a single, RoHS-compliant FPGA package. Its Cyclone III family heritage brings low-power operation and system-level clocking flexibility to designs that must meet cost, power, and integration targets.

This device is suitable for engineers building industrial, communications, portable, and consumer systems who require a durable, well-specified FPGA platform with vendor-provided device features and design flow support for scalable implementations.

Request a quote or submit an inquiry to receive pricing and availability for the EP3C120F780I7N.

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