EP3C16E144A7N

The EP3C16E144A7N is a Cyclone III family FPGA in a 144-lead LQFP exposed-pad package, delivering 15,408 logic elements and approximately 0.516 Mbits of embedded RAM. Designed for applications that require mid-range logic density, significant on-chip memory, and flexible I/O, this device targets cost- and power-sensitive designs with demanding temperature and qualification requirements.

As a member of the Cyclone III device family, it benefits from the series' low-power process optimizations and architecture. The device is qualified to AEC-Q100 and specified for operation from –40 °C to 125 °C, making it suitable for automotive-grade and other temperature-challenging environments where component qualification and reliability matter.

Key Features

• Logic Capacity  Provides 15,408 logic elements enabling mid-range FPGA integration for glue logic, protocol bridging, and custom digital functions.
• Embedded Memory  Approximately 516,096 bits (~0.516 Mbits) of on-chip RAM to support packet buffering, small FIFOs, and state storage without external memory.
• I/O Count & Flexibility  84 I/Os in a compact 144-LQFP exposed-pad package, supporting a variety of digital interfaces and board-level connectivity.
• Package & Mounting  144-LQFP exposed pad (20 × 20) with surface-mount mounting type for reliable thermal dissipation and PCB assembly.
• Power Supply Range  Core voltage specified from 1.15 V to 1.25 V to match system power rails and power-management schemes.
• Automotive Qualification  AEC-Q100 qualification and an operating temperature range of –40 °C to 125 °C for designs requiring automotive-grade components.
• Cyclone III Family Characteristics  Built on the Cyclone III family architecture, which emphasizes low-power operation and high functionality for cost-sensitive, high-volume applications.

Typical Applications

• Automotive Electronics  Engine control modules, body electronics, or gateway functions leveraging AEC-Q100 qualification and wide operating temperature range.
• Industrial Control  Motor control, factory automation interfaces, and protocol conversion where robust I/O and temperature resilience are required.
• Embedded System Integration  Custom logic, peripheral aggregation, and timing-critical glue logic for compact embedded platforms.
• Communications & I/O Bridging  Protocol bridging, signal buffering, and interface adaptation using on-chip logic and embedded memory.

Unique Advantages

• AEC-Q100 Qualified: Certified for automotive use, supporting designs that require industry-recognized component qualification and extended temperature operation.
• Mid-Range Integration: 15,408 logic elements and ~0.516 Mbits of RAM reduce the need for external components, simplifying BOM and PCB area.
• Flexible I/O in a Compact Package: 84 I/Os in a 144-LQFP exposed-pad footprint provide a balance of connectivity and manufacturability for dense boards.
• Low-Power Family Benefits: Leverages Cyclone III’s low-power process and silicon/flow optimizations to help meet system power budgets.
• Wide Operating Range: Specified for −40 °C to 125 °C and a narrow core-voltage range (1.15–1.25 V), enabling predictable operation across temperature and power conditions.

Why Choose EP3C16E144A7N?

The EP3C16E144A7N is positioned for customers needing a mid-density FPGA with automotive-grade qualification, dependable thermal performance, and a compact package. Its combination of 15,408 logic elements, embedded memory, and 84 general-purpose I/Os makes it suited to reduce external components while maintaining flexible system integration.

Choose this Cyclone III device when your design requires AEC-Q100 qualification, extended temperature operation, and the Cyclone III family’s low-power, high-functionality architecture for cost- and power-sensitive production designs.

Request a quote or contact our sales team to check availability, pricing, and lead time for the EP3C16E144A7N.