EP3C16E144C8N

The EP3C16E144C8N is an Intel Cyclone® III field-programmable gate array (FPGA) in a 144-LQFP exposed-pad package designed for commercial applications. It provides 15,408 logic elements, approximately 0.5 Mbits of embedded memory, and 84 user I/Os in a surface-mount form factor.

As part of the Cyclone III device family, this device is built on a low-power process and targets high-functionality, cost-sensitive designs that need a balance of logic density, on-chip memory, and flexible clocking and I/O resources.

Key Features

• Device Core  15,408 logic elements for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 0.5 Mbits of on-chip RAM for data buffering, FIFOs, and state storage.
• I/O Resources  84 general-purpose I/Os to support multiple parallel interfaces and board-level connectivity.
• Clocking  Cyclone III family clocking architecture including up to four phase-locked loops (PLLs) per device for flexible clock generation and management.
• Low-Power Platform  Built on TSMC low-power process technology; the Cyclone III family emphasizes low static power for battery-powered and thermally constrained designs.
• Supported I/O Standards  Family-level support for a wide range of industry I/O standards to simplify interface design and signal integrity tuning.
• Package & Mounting  144-LQFP exposed-pad package (surface mount) with supplier device package listed as 144-EQFP (20×20) for compact PCB integration and thermal conduction.
• Voltage & Grade  Core supply range of 1.15 V to 1.25 V; commercial temperature grade with operating range 0 °C to 85 °C.
• Environmental  RoHS compliant.

Typical Applications

• Portable and Handheld Devices  Low-power architecture and compact LQFP packaging make this FPGA suitable for battery-conscious, space-limited designs that require custom logic and local processing.
• Consumer Electronics  Use for interface bridging, feature control, and medium-density logic integration where on-chip memory and multiple I/Os reduce external components.
• Communications and Data Interfaces  Flexible I/O and multiple PLLs enable implementation of serial/parallel interface logic, clock management, and protocol bridging.
• Embedded Control and Custom Logic  Adequate logic element capacity and embedded RAM for state machines, motor control logic, and application-specific accelerators in commercial systems.

Unique Advantages

• High Logic Capacity: 15,408 logic elements provide the gate count needed for medium-complexity custom logic and control functions, reducing the need for multiple discrete components.
• On-Chip Memory: Approximately 0.5 Mbits of embedded RAM supports buffering and local data storage, simplifying PCB designs and lowering BOM cost.
• Flexible Clocking: Family-level support for multiple PLLs enables precise clock synthesis and distribution for interface timing and performance optimization.
• Compact, Manufacturable Package: 144-LQFP exposed pad surface-mount package eases assembly and improves thermal performance for compact designs.
• Low-Voltage Operation: 1.15 V to 1.25 V core supply range supports low-power system architectures and helps meet power budgets in portable applications.
• Regulatory and Environmental Compliance: RoHS compliance aids in meeting environmental and manufacturing requirements.

Why Choose EP3C16E144C8N?

The EP3C16E144C8N positions itself as a practical Cyclone III FPGA choice for commercial designs that demand a balance of logic density, embedded memory, and flexible I/O within a compact surface-mount package. Its low-power family heritage and on-chip clocking resources make it suitable for cost-sensitive, thermally-constrained, or battery-powered products.

This device is well suited to engineers building medium-complexity custom logic, interface bridges, and embedded control systems who need predictable commercial-temperature operation and a compact package compatible with standard PCB assembly flows.

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