EP3C16F256A7N

IC FPGA 168 I/O 256FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 168 516096 15408 256-LBGA

Quantity 110 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case256-LBGANumber of I/O168Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs963Number of Logic Elements/Cells15408
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits516096

Overview of EP3C16F256A7N – Cyclone® III Field Programmable Gate Array (FPGA) IC 168 516096 15408 256-LBGA

The EP3C16F256A7N is a Cyclone III family FPGA offered in a 256-ball BGA package and designed for low-power, cost-sensitive applications. It provides 15,408 logic elements, approximately 0.5 Mbits of embedded memory, and 168 user I/Os in a compact surface-mount 256-LBGA footprint.

Targeted at designs that require balanced logic density, on-chip RAM, and flexible I/O, this device is qualified to AEC‑Q100 for automotive deployment and supports a wide operating range from -40 °C to 125 °C with a core supply of 1.15 V to 1.25 V.

Key Features

  • Logic Capacity — 15,408 logic elements provide a mid-range fabric suitable for control, protocol bridging, and signal processing tasks.
  • On‑Chip Memory — 516,096 total RAM bits, approximately 0.5 Mbits of embedded memory for buffers, FIFOs, and small data stores.
  • I/O Resources — 168 user I/Os to support multiple external interfaces and high pin-count connectivity in a single device.
  • Clock Management — Cyclone III family architecture provides multiple PLLs for clock synthesis and distribution (family-level feature).
  • Low‑Power Family Characteristics — Cyclone III devices are built on a low-power process with silicon and tooling optimizations for reduced static power (family-level feature).
  • Package and Mounting — Surface-mount 256-LBGA package (supplier device package: 256-FBGA, 17×17) for dense PCB implementations.
  • Automotive Qualification — Grade: Automotive with AEC‑Q100 qualification for designs requiring industry-standard automotive validation.
  • Voltage and Temperature — Core supply 1.15 V to 1.25 V; operating temperature range -40 °C to 125 °C.
  • Standards and I/O Flexibility — Cyclone III family supports a broad set of I/O standards (family-level feature) to match diverse interface requirements.
  • RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

  • Automotive Systems — Suitable for automotive control and signal processing modules where AEC‑Q100 qualification and wide temperature range are required.
  • Portable and Handheld Devices — Low-power family characteristics enable use in battery-powered equipment that benefits from reduced static power.
  • Industrial Control — Mid-range logic capacity and ample I/O support sensor interfacing, motor control logic, and protocol conversion tasks.
  • Communications and Networking — On-chip RAM and flexible I/O enable buffering and custom interface implementations in mid-density communication endpoints.

Unique Advantages

  • Balanced Integration: Combines 15,408 logic elements with approximately 0.5 Mbits of embedded memory and 168 I/Os to reduce external component count and simplify board layout.
  • Automotive‑Ready: AEC‑Q100 qualification and an extended -40 °C to 125 °C operating range provide the reliability needed for vehicle environments.
  • Compact Package: 256-LBGA (256-FBGA 17×17) enables high-density placement on space-constrained PCBs while maintaining robust I/O capability.
  • Low Core Voltage: Operates from 1.15 V to 1.25 V, aligning with modern low-voltage system power architectures.
  • Proven Family Features: Leverages Cyclone III family characteristics—low-power silicon optimizations, multiple PLLs, and broad I/O standard support—for flexible system design.
  • Regulatory and Environmental Compliance: RoHS compliance supports environmental requirements across global markets.

Why Choose EP3C16F256A7N?

The EP3C16F256A7N positions itself as a mid-density, low-power FPGA option within the Cyclone III family, offering a practical balance of logic, embedded memory, and I/O in a compact automotive‑qualified package. Its combination of AEC‑Q100 qualification, wide temperature range, and family-level low-power design makes it suitable for engineers developing robust systems for automotive, industrial, and portable applications.

Choose this device when your design requires measurable logic and memory resources, flexible interfacing, and automotive-grade reliability in a surface-mount BGA footprint—while benefiting from the Cyclone III family ecosystem and device-level clock and integration features.

Request a quote or submit your specifications to receive pricing and availability for the EP3C16F256A7N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up