EP3C16F256A7N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 168 516096 15408 256-LBGA |
|---|---|
| Quantity | 110 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 168 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 516096 |
Overview of EP3C16F256A7N – Cyclone® III Field Programmable Gate Array (FPGA) IC 168 516096 15408 256-LBGA
The EP3C16F256A7N is a Cyclone III family FPGA offered in a 256-ball BGA package and designed for low-power, cost-sensitive applications. It provides 15,408 logic elements, approximately 0.5 Mbits of embedded memory, and 168 user I/Os in a compact surface-mount 256-LBGA footprint.
Targeted at designs that require balanced logic density, on-chip RAM, and flexible I/O, this device is qualified to AEC‑Q100 for automotive deployment and supports a wide operating range from -40 °C to 125 °C with a core supply of 1.15 V to 1.25 V.
Key Features
- Logic Capacity — 15,408 logic elements provide a mid-range fabric suitable for control, protocol bridging, and signal processing tasks.
- On‑Chip Memory — 516,096 total RAM bits, approximately 0.5 Mbits of embedded memory for buffers, FIFOs, and small data stores.
- I/O Resources — 168 user I/Os to support multiple external interfaces and high pin-count connectivity in a single device.
- Clock Management — Cyclone III family architecture provides multiple PLLs for clock synthesis and distribution (family-level feature).
- Low‑Power Family Characteristics — Cyclone III devices are built on a low-power process with silicon and tooling optimizations for reduced static power (family-level feature).
- Package and Mounting — Surface-mount 256-LBGA package (supplier device package: 256-FBGA, 17×17) for dense PCB implementations.
- Automotive Qualification — Grade: Automotive with AEC‑Q100 qualification for designs requiring industry-standard automotive validation.
- Voltage and Temperature — Core supply 1.15 V to 1.25 V; operating temperature range -40 °C to 125 °C.
- Standards and I/O Flexibility — Cyclone III family supports a broad set of I/O standards (family-level feature) to match diverse interface requirements.
- RoHS Compliant — Conforms to RoHS environmental requirements.
Typical Applications
- Automotive Systems — Suitable for automotive control and signal processing modules where AEC‑Q100 qualification and wide temperature range are required.
- Portable and Handheld Devices — Low-power family characteristics enable use in battery-powered equipment that benefits from reduced static power.
- Industrial Control — Mid-range logic capacity and ample I/O support sensor interfacing, motor control logic, and protocol conversion tasks.
- Communications and Networking — On-chip RAM and flexible I/O enable buffering and custom interface implementations in mid-density communication endpoints.
Unique Advantages
- Balanced Integration: Combines 15,408 logic elements with approximately 0.5 Mbits of embedded memory and 168 I/Os to reduce external component count and simplify board layout.
- Automotive‑Ready: AEC‑Q100 qualification and an extended -40 °C to 125 °C operating range provide the reliability needed for vehicle environments.
- Compact Package: 256-LBGA (256-FBGA 17×17) enables high-density placement on space-constrained PCBs while maintaining robust I/O capability.
- Low Core Voltage: Operates from 1.15 V to 1.25 V, aligning with modern low-voltage system power architectures.
- Proven Family Features: Leverages Cyclone III family characteristics—low-power silicon optimizations, multiple PLLs, and broad I/O standard support—for flexible system design.
- Regulatory and Environmental Compliance: RoHS compliance supports environmental requirements across global markets.
Why Choose EP3C16F256A7N?
The EP3C16F256A7N positions itself as a mid-density, low-power FPGA option within the Cyclone III family, offering a practical balance of logic, embedded memory, and I/O in a compact automotive‑qualified package. Its combination of AEC‑Q100 qualification, wide temperature range, and family-level low-power design makes it suitable for engineers developing robust systems for automotive, industrial, and portable applications.
Choose this device when your design requires measurable logic and memory resources, flexible interfacing, and automotive-grade reliability in a surface-mount BGA footprint—while benefiting from the Cyclone III family ecosystem and device-level clock and integration features.
Request a quote or submit your specifications to receive pricing and availability for the EP3C16F256A7N.

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