EP3C16F256C7N

The EP3C16F256C7N is an Intel Cyclone® III family FPGA delivering mid-range logic capacity and embedded memory in a compact 256-LBGA surface-mount package. The device targets cost-sensitive, low-power designs that require flexible programmable logic, moderate on-chip RAM, and a substantial I/O count.

With 15,408 logic elements and approximately 0.5 Mbits of embedded memory (516,096 total RAM bits), this part is suited for embedded systems, consumer and communications applications where a balance of integration, power efficiency, and package density is required.

Key Features

• Logic Capacity — 15,408 logic elements for implementing custom digital functions and control logic.
• Embedded Memory — Approximately 0.5 Mbits (516,096 bits) of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Resources — 168 user I/O pins to support multiple peripheral interfaces and board-level routing requirements.
• Power Supply — Core voltage supply range of 1.15 V to 1.25 V to match system power rails and enable low-power operation.
• Package & Mounting — 256-LBGA package; supplier device package listed as 256-FBGA (17×17). Surface-mount mounting type for compact PCB integration.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards & Compliance — RoHS compliant.
• Cyclone III Family Attributes — Family-level features described in the Cyclone III handbook include low-power architecture and system integration features such as multiple PLLs, a high memory-to-logic ratio, and broad I/O standard support.

Typical Applications

• Embedded Control — Implement real-time control logic, protocol bridging, and device-level state machines using programmable logic and on-chip RAM.
• Consumer Electronics — Enable customizable interfaces, feature upgrades, and peripheral management in compact, cost-sensitive consumer devices.
• Communications & Networking — Implement protocol handling, data buffering, and glue logic where moderate logic density and multiple I/Os are required.
• Portable/Handheld Systems — Leverage family low-power characteristics and compact FBGA packaging for battery-powered devices where commercial temperature range is acceptable.

Unique Advantages

• Balanced Logic-to-Memory Ratio: 15,408 logic elements combined with ~0.5 Mbits of embedded RAM supports mixed control and data-path designs without external memory for many use cases.
• High I/O Count: 168 I/Os provide flexibility for multiple parallel interfaces, external peripherals, and board-level routing choices.
• Compact Surface-Mount Package: 256-LBGA (256-FBGA, 17×17) enables space-efficient PCB layouts for compact systems.
• Low-Power Family Design: Cyclone III family design emphasizes reduced power consumption and system-level power-aware flows, aligning with cost-sensitive, thermally constrained applications.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for designs that operate in standard commercial environments.
• RoHS Compliance: Meets lead-free and hazardous-substance requirements for modern manufacturing processes.

Why Choose EP3C16F256C7N?

The EP3C16F256C7N provides a practical combination of programmable logic density, embedded memory, and a high I/O count in a compact surface-mount package for cost- and power-sensitive designs. Its Cyclone III family heritage offers a focus on low power and system integration, making it a fit for embedded control, consumer, and communications applications where commercial-grade temperature operation is acceptable.

Designers benefit from a mature device family with available design flow support and system-level features documented in the Cyclone III handbook, enabling streamlined development and deployment for moderate-complexity FPGA implementations.

Request a quote or submit an inquiry to check availability and pricing for EP3C16F256C7N and to discuss how this Cyclone III FPGA can fit your next design.