EP3C16F256C8

The EP3C16F256C8 is a Cyclone® III Field Programmable Gate Array (FPGA) offered in a 256-LBGA package. It integrates 15,408 logic elements, approximately 0.52 Mbits of embedded memory (516,096 bits), and 168 user I/Os, making it suitable for low-power, mid-density programmable logic applications in commercial designs.

This device is built around the Cyclone III family architecture, offering a balance of integration, low-power operation, and flexible I/O and clock management for cost-sensitive systems.

Key Features

• Logic Capacity  15,408 logic elements provide programmable resources for custom digital functions and moderate-complexity designs.
• Embedded Memory  516,096 bits of on-chip RAM (approximately 0.52 Mbits) for data buffering, FIFOs, and embedded storage.
• Configurable I/O  168 user I/Os support diverse interfacing requirements; adjustable I/O slew rates and family-level support for multiple I/O standards are provided by the Cyclone III architecture.
• Clock Management  Cyclone III family devices include integrated phase-locked loops (PLLs) for robust clock synthesis and distribution.
• Power  Designed with low-power process technology; device supply voltage range is 1.15 V to 1.25 V to support power-optimized system designs.
• Package and Mounting  256-LBGA package, surface-mount mounting; supplier package listed as 256-FBGA (17×17).
• Operating Range  Commercial temperature grade with operating range from 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental and regulatory conformity.

Typical Applications

• Embedded Control  Implement custom digital control, glue-logic, and protocol conversion in compact embedded systems using the device's logic and I/O resources.
• Communications Interfaces  Use the programmable I/O and on-chip memory for bridging, buffering, and timing in network and serial-interface applications.
• Consumer and Industrial Electronics  Integrate peripheral control, user interfaces, and mid-range signal processing where low-power operation and moderate logic density are required.
• Prototyping and Low-Volume Production  Rapidly iterate hardware designs and validate IP using the Cyclone III FPGA fabric and embedded resources.

Unique Advantages

• Balanced Integration: Combines 15,408 logic elements with on-chip RAM and 168 I/Os to reduce external components and simplify board-level design.
• Low-Power Foundation: Based on low-power process technology and a narrow supply voltage range (1.15 V–1.25 V) to help optimize system power consumption.
• Compact Package: 256-LBGA (supplier package 256-FBGA, 17×17) enables a high-density FPGA solution in a small PCB footprint.
• Flexible Clocking: Built-in PLL resources in the Cyclone III family support complex clocking schemes without added external components.
• Design-Ready I/O: 168 user I/Os and family-level support for multiple I/O standards allow interfacing with a wide range of peripherals and buses.
• Environmentally Compliant: RoHS compliance supports regulatory and supply-chain requirements for commercial products.

Why Choose EP3C16F256C8?

The EP3C16F256C8 places mid-range FPGA capacity and on-chip memory into a compact, surface-mount 256-LBGA package, delivering a pragmatic balance of logic, memory, and I/O for cost-sensitive commercial applications. Its supply voltage range and family-level low-power design elements make it a suitable option where power efficiency and integration matter.

This Cyclone III device is well suited to engineers needing a scalable, supported FPGA platform for embedded control, interface bridging, and moderate signal-processing tasks. The combination of logic resources, embedded RAM, PLL-based clock management, and a high I/O count provides a flexible building block for a wide range of designs.

Request a quote or submit an inquiry to get pricing and availability for EP3C16F256C8 and to discuss how it fits your design requirements.