EP3C16F484A7N

The EP3C16F484A7N is an Intel Cyclone III FPGA supplied in a 484-ball BGA (23 × 23) package. It combines mid-range logic capacity with on-chip memory and a high I/O count to address cost-sensitive, low-power embedded designs.

Targeted at applications that require robust operation across extended temperature ranges, this device is AEC-Q100 qualified for automotive use, offers a core voltage range of 1.15 V to 1.25 V, and operates from –40 °C to 125 °C.

Key Features

• Logic Capacity — 15,408 logic elements for implementing mid-range combinational and sequential logic functions.
• Embedded Memory — Approximately 0.5 Mbits (516,096 bits) of on-chip RAM for buffering, FIFOs, and small data storage.
• High I/O Count — 346 I/O pins to support dense peripheral interfacing and multi-channel I/O connectivity.
• Power and Core Voltage — Optimized for low-power operation with a specified core supply range of 1.15 V to 1.25 V.
• Clock Management — Family-level support for multiple PLLs to manage clock synthesis and distribution (Cyclone III device family feature).
• Package and Mounting — 484-FBGA (23 × 23) surface-mount package suitable for compact PCB designs.
• Automotive Qualification — AEC-Q100 qualified and specified for operation from –40 °C to 125 °C.
• Standards and Compliance — RoHS-compliant materials for global regulatory compatibility.

Typical Applications

• Automotive control systems: AEC-Q100 qualification and extended temperature range make this device suitable for in-vehicle control, sensor aggregation, and human–machine interface tasks.
• Industrial automation: High I/O count and reliable operation over –40 °C to 125 °C enable sensor interfacing, motor-control logic, and protocol bridging in rugged environments.
• Embedded processing and glue logic: Mid-range logic density and on-chip RAM support custom peripherals, timing-critical glue logic, and small embedded subsystems.
• Data acquisition and I/O expansion: 346 I/Os support multi-channel data capture, signal conditioning interfaces, and flexible I/O standard support (family-level feature).

Unique Advantages

• Automotive-grade qualification: AEC-Q100 certification and wide operating temperature range give confidence for automotive and other harsh-environment applications.
• Balanced mid-range resources: 15,408 logic elements with approximately 0.5 Mbits of embedded RAM provide the right balance of logic and memory for many embedded designs without excessive cost or complexity.
• High I/O density: 346 I/Os simplify system integration by reducing the need for external I/O expanders and enabling direct sensor and peripheral connections.
• Compact BGA footprint: 484-FBGA (23 × 23) package supports dense PCB layouts while maintaining robust solder attachment for production assemblies.
• Regulatory readiness: RoHS compliance supports deployment in regions with environmental material restrictions.

Why Choose EP3C16F484A7N?

The EP3C16F484A7N positions itself as a mid-range Cyclone III FPGA that balances programmable logic capacity, embedded memory, and a high I/O count within a compact BGA package. Its AEC-Q100 qualification and –40 °C to 125 °C operating range make it suitable for designs that must withstand demanding thermal environments while remaining power-aware and cost-conscious.

Engineers building automotive, industrial, or embedded systems will find this device a practical choice when they need on-chip flexibility, solid I/O resources, and vendor-backed family capabilities for clock management and low-power operation.

Request a quote or submit an inquiry to learn more about availability, pricing, and how EP3C16F484A7N can fit into your next design.