EP3C16F484C6N

The EP3C16F484C6N is a Cyclone® III family FPGA delivering a balance of logic density, embedded memory, and I/O capacity for cost- and power-sensitive designs. This surface-mount device provides 15,408 logic elements and 516,096 bits of on-chip RAM, making it suitable for high-volume, low-power applications where integration and efficiency matter.

Built around the Cyclone III device family architecture, the part targets applications that require moderate logic resources, significant I/O count, and low-voltage operation while maintaining commercial-grade operating conditions.

Key Features

• Logic Capacity  15,408 logic elements for mid-range digital integration and custom logic implementation.
• Embedded Memory  516,096 bits of on-chip RAM (approximately 0.5 Mbits) to support buffers, FIFOs, and embedded data storage without external components.
• I/O Count  346 user I/Os to accommodate multiple interfaces, sensors, and high-pin-count system connections.
• Power Supply  Core voltage range of 1.15 V to 1.25 V to match low-voltage system rails and minimise power draw.
• Package & Mounting  484-ball FBGA package (484-FBGA, 23×23) in a 484-BGA package case, designed for surface-mount assembly.
• Operating Range  Commercial temperature grade: 0 °C to 85 °C for standard commercial applications.
• Cyclone III Family Benefits  Family-level characteristics include low-power architecture and features for increased system integration such as PLL-based clock management and a high memory-to-logic ratio (as described in the Cyclone III device family documentation).
• RoHS Compliant  Meets RoHS environmental requirements for lead-free assembly processes.

Typical Applications

• Portable and Handheld Devices  Low-power device family characteristics suit battery-powered designs that need logic integration and on-chip memory.
• Consumer Electronics  Mid-range logic capacity and large I/O count enable interface control, display drivers, and peripheral management in consumer products.
• Industrial Control and Instrumentation  Commercial-grade temperature range and substantial I/O support sensor interfacing, motor control logic, and system monitoring in non-automotive industrial equipment.
• Embedded Systems  On-chip RAM and logic resources support embedded processing tasks, custom accelerators, and glue-logic for system integration.

Unique Advantages

• Compact, High-Connectivity Package: 484-FBGA (23×23) offers dense I/O in a compact surface-mount form factor to simplify PCB routing and board-level integration.
• Significant On-Chip Memory: 516,096 bits of embedded RAM reduce the need for external memory, lowering BOM cost and board complexity.
• Low-Voltage Operation: 1.15–1.25 V core supply supports low-power system designs and helps meet stringent power budgets.
• Ample I/O Resources: 346 user I/Os enable multiple peripheral and interface connections without multiplexing or external expanders.
• Family-Level Low Power: As part of the Cyclone III family, the device benefits from a low-power process and architecture suited for high-volume, cost-sensitive applications.
• RoHS Compliance: Lead-free compatibility for modern assembly and environmental requirements.

Why Choose EP3C16F484C6N?

The EP3C16F484C6N positions itself as a practical mid-range FPGA for designers seeking a balance of logic resources, embedded memory, and a high I/O count within a low-voltage, surface-mount package. Its commercial temperature rating and RoHS compliance make it suitable for mainstream consumer, portable, and industrial applications where efficient integration and reduced BOM are priorities.

Choose this Cyclone III device when you need a cost-conscious FPGA solution that offers on-chip memory and generous I/O capacity while leveraging the family’s low-power and system-integration features described in the Cyclone III device documentation.

Request a quote or submit a procurement inquiry to get pricing and availability for the EP3C16F484C6N.