EP3C16F484C8

The EP3C16F484C8 is a Cyclone® III family Field Programmable Gate Array (FPGA) IC from Intel, optimized for low-power, cost-sensitive designs. It pairs a mid-range logic capacity with a high I/O count and on-chip memory to address applications that require flexible, reconfigurable digital logic and robust system integration.

Designed for commercial-temperature systems, this surface-mount 484‑FBGA device targets high-volume consumer and embedded markets where power efficiency, integration, and I/O density are primary considerations.

Key Features

• Logic Capacity — 15,408 logic elements provide substantial combinational and sequential resources for medium-complexity FPGA designs.
• Embedded Memory — Approximately 0.5 Mbits (516,096 bits) of on-chip RAM for data buffering, FIFOs, and small block-memory needs.
• I/O Density — 346 I/Os to support broad external interfacing and parallel connectivity requirements.
• Package & Mounting — 484‑FBGA (23 × 23 mm) package in a surface-mount form factor for compact PCB layouts and automated assembly.
• Power Supply — Core voltage range 1.15 V to 1.25 V, aligning with low-voltage system architectures.
• Commercial Temperature — Rated for 0 °C to 85 °C operation for mainstream embedded and consumer applications.
• Low-Power Family Attributes — Based on Cyclone III family technology that emphasizes low static power through process and silicon optimizations.
• Clock Management — Cyclone III family devices provide advanced PLL-based clocking and synthesis capabilities for flexible timing architectures.
• Standards & I/O Flexibility — Cyclone III family supports a wide array of I/O standards and adjustable I/O slew rates to improve signal integrity across interfaces.
• RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing and assembly.

Typical Applications

• Portable and Handheld Devices — Low-power Cyclone III family attributes help extend battery life while providing reconfigurable logic for control and user interface functions.
• Consumer Electronics — Medium-density logic and abundant I/Os suit high-volume, cost-sensitive products requiring flexible interfacing and on-the-fly updates.
• I/O-Intensive Interfaces — 346 I/Os enable parallel data paths, bridging, and multi-protocol front-ends in communication and multimedia equipment.
• Embedded Control and Signal Processing — On-chip RAM combined with substantial logic elements supports control loops, data buffering, and moderate DSP tasks.

Unique Advantages

• Balanced System Integration: Combines mid-range logic capacity with significant I/O and embedded RAM to reduce external component count and simplify PCB designs.
• Power-Efficient Operation: Cyclone III family optimizations and a low core voltage range help reduce static and dynamic power for thermally constrained designs.
• High I/O Count: 346 user I/Os support extensive peripheral and bus connectivity without resorting to external I/O expanders.
• Compact, Assembly-Ready Package: 484‑FBGA (23 × 23) surface-mount package enables dense board layouts and automated manufacturing workflows.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation to match typical embedded and consumer environmental requirements.
• Standards Flexibility: Family-level support for multiple I/O standards and adjustable slew rates eases integration with a wide range of interfaces and signaling levels.

Why Choose EP3C16F484C8?

The EP3C16F484C8 delivers a practical balance of logic resources, embedded memory, and one of the higher I/O counts available in a mid-range Cyclone III device. Its surface-mount 484‑FBGA package and RoHS compliance make it suitable for compact, production-oriented assemblies where power, connectivity, and cost are important design drivers.

This device is well suited to engineers building cost-sensitive consumer and embedded systems that need reconfigurable logic, flexible I/O, and efficient power usage, backed by the Cyclone III family architecture and documentation set.

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