EP3C16F484I7

The EP3C16F484I7 is an industrial-grade Cyclone® III field programmable gate array (FPGA) in a 484-ball BGA package. It provides 15,408 logic elements and approximately 0.5 Mbits of embedded memory, combined with 346 user I/Os for medium-density programmable logic integration.

Designed as part of the Cyclone III family, the device emphasizes low power and system integration for cost-sensitive and thermally constrained applications, while supporting a broad set of design and clock-management features defined by the Cyclone III architecture.

Key Features

• Logic Capacity — 15,408 logic elements to implement medium-complexity logic and control functions.
• Embedded Memory — Approximately 0.5 Mbits of on-chip RAM for buffering, small data tables, and state storage.
• I/O Count & Flexibility — 346 user I/O pins to support multi-channel interfaces and board-level routing density.
• Low-Power Family Characteristics — Cyclone III family architecture and low-power process optimizations target reduced static power for battery- or thermally-constrained designs.
• Clock Management — Cyclone III family devices provide integrated PLL resources for flexible clock synthesis and distribution.
• Package & Mounting — 484-ball FBGA (23×23) package with surface-mount mounting for compact PCB integration.
• Voltage Supply — Core supply range of 1.15 V to 1.25 V for compatibility with Cyclone III supply rails.
• Industrial Operating Range — Rated for −40 °C to 100 °C ambient operation for industrial deployments.
• RoHS Compliant — Conforms to RoHS requirements for environmental compliance.

Typical Applications

• Industrial Control — Implement motor control logic, sensor aggregation, and real-time control where industrial temperature range and robust I/O count are required.
• Communications and Networking — Use for protocol bridging, packet processing, and interface adaptation leveraging the device’s logic, embedded memory, and plentiful I/O.
• Embedded System Integration — Integrate glue logic, peripheral controllers, and custom accelerators in compact BGA packages for space-constrained PCBs.
• Consumer & Portable Electronics — Apply the low-power characteristics of the Cyclone III family to extend battery life and reduce cooling needs in portable or handheld products.

Unique Advantages

• Balanced Logic and Memory — 15,408 logic elements paired with approximately 0.5 Mbits of embedded RAM provide a practical balance for medium-density designs without external memory dependency.
• High I/O Density — 346 available I/Os simplify board-level integration of multiple interfaces and peripherals, reducing the need for extra interface chips.
• Industrial Temperature Rating — Specified −40 °C to 100 °C operation supports deployment in demanding thermal environments typical of industrial systems.
• Compact Surface-Mount BGA — 484-FBGA (23×23) packaging enables high-density PCB layouts and reliable board mounting for volume production.
• Power-Efficient Architecture — Built on Cyclone III low-power design principles to help meet constrained power budgets in portable and embedded systems.
• Standards-Ready Family Features — Cyclone III family features such as integrated PLLs and broad I/O standard support aid in implementing complex clock and interface requirements.

Why Choose EP3C16F484I7?

The EP3C16F484I7 combines medium-density logic, on-chip memory, and a high I/O count in an industrial-grade, surface-mount 484-FBGA package. Its Cyclone III family heritage brings low-power design optimizations and integrated clock-management resources, making it well suited for designers targeting cost-sensitive, thermally constrained, or space-limited applications.

This device is a practical choice for engineering teams building embedded controllers, interface bridges, and communication modules that require a reliable, RoHS-compliant FPGA with defined industrial temperature and supply voltage characteristics.

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