EP3C16M164I7N

The EP3C16M164I7N is an Intel Cyclone III family FPGA in a 164‑TFBGA package, designed for cost- and power-sensitive embedded designs. It integrates 15,408 logic elements and approximately 0.5 Mbits of embedded memory (516,096 bits), with 92 user I/O pins to support a wide range of digital interfaces.

As a member of the Cyclone III device family, it benefits from the family’s focus on low power and high functionality, making it suitable for industrial applications that require reliable programmable logic in a compact surface‑mount package.

Key Features

• Core Logic  15,408 logic elements provide programmable combinational and sequential resources for custom digital functions and glue logic.
• On‑Chip Memory  Approximately 0.5 Mbits of embedded RAM (516,096 bits) for buffers, FIFOs, and small data stores without external memory.
• I/O Capacity  92 I/O pins in a 164‑TFBGA package support multiple external interfaces and system signals.
• Low‑Voltage Operation  Core voltage supply range of 1.15 V to 1.25 V for low-power core operation aligned with Cyclone III family optimizations.
• Package & Mounting  164‑TFBGA (supplier package: 164‑MBGA, 8×8) surface‑mount package for compact PCB integration.
• Industrial Temperature Range  Rated for operation from -40°C to 100°C, suitable for industrial environments.
• Standards & Compliance  RoHS‑compliant component suitable for modern manufacturing and environmental requirements.

Typical Applications

• Industrial Control  Implement custom I/O aggregation, protocol bridging, and real‑time logic in control systems that require industrial temperature operation.
• Embedded Systems  Integrate glue logic, peripheral interfaces, and small buffering functions using on‑chip RAM and abundant logic elements.
• Communications Interfaces  Support medium‑complexity interface adaptation and timing control across multiple I/Os in compact systems.

Unique Advantages

• Compact, Surface‑Mount Package: The 164‑TFBGA (164‑MBGA, 8×8) package enables dense PCB layouts while providing 92 accessible I/Os.
• Balance of Logic and Memory: 15,408 logic elements paired with ~0.5 Mbits of embedded RAM lets you implement control logic and local buffering without external SRAM for many use cases.
• Low‑Voltage Core: A 1.15–1.25 V supply range supports power‑efficient designs consistent with low‑power Cyclone III family operation.
• Industrial‑Grade Temperature: Rated from -40°C to 100°C for reliable operation in temperature‑challenged industrial environments.
• RoHS Compliance: Environmentally compliant construction simplifies regulatory and manufacturing requirements.

Why Choose EP3C16M164I7N?

The EP3C16M164I7N delivers a practical mix of programmable logic density, embedded memory, and I/O capability in a compact industrial‑rated package. It is well suited to designers who need a low‑power Cyclone III FPGA to handle interface logic, custom control functions, and embedded buffering while minimizing board area and power consumption.

Choosing this FPGA gives you access to Cyclone III family characteristics—low power, high functionality, and a mature ecosystem—making it a sound choice for high‑volume, cost‑sensitive, and industrial applications that require dependable programmable logic.

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