EP3C16U256A7N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 168 516096 15408 256-LFBGA |
|---|---|
| Quantity | 326 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-UBGA (14x14) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 168 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 516096 |
Overview of EP3C16U256A7N – Cyclone® III FPGA, 15,408 logic elements, 256‑LFBGA
The EP3C16U256A7N is an Intel Cyclone® III field-programmable gate array delivering mid-range logic capacity and low-power operation for cost-sensitive, high-volume designs. Built on the Cyclone III device family architecture, it combines 15,408 logic elements with on-chip embedded memory and flexible I/O to address embedded control, connectivity and mixed-signal interface tasks.
Qualified to AEC‑Q100 and specified for automotive grade use, this surface-mount FPGA is targeted at applications that require robust temperature range and regulated voltage operation with a compact 256‑LFBGA (256‑UBGA 14×14) footprint.
Key Features
- Logic Capacity 15,408 logic elements and 963 logic array blocks provide mid-range programmable logic for control, signal processing and glue-logic implementations.
- Embedded Memory Approximately 0.5 Mbits (516,096 total RAM bits) of on-chip memory for buffering, FIFO and small data-storage requirements.
- I/O Density & Standards 168 user I/Os to support multiple interfaces; device family supports common I/O standards and adjustable slew rates for system-level signal integrity.
- Clock Management Device family includes up to four phase-locked loops (PLLs) for clock synthesis, distribution and dynamic reconfiguration of phase and frequency.
- Low-Voltage Core Core supply range of 1.15 V to 1.25 V to support low-power system architectures.
- Automotive Qualification Automotive grade with AEC‑Q100 qualification and an extended operating temperature range of −40°C to 125°C for harsh-environment deployments.
- Package & Mounting 256‑LFBGA (supplier package: 256‑UBGA, 14×14) in a surface-mount form factor for compact PCB designs.
- RoHS Compliant Meets RoHS environmental requirements.
Typical Applications
- Automotive Systems Sensor interfacing, vehicle networking interfaces and domain controllers where AEC‑Q100 qualification and wide temperature range are required.
- Portable and Handheld Devices Low-power operation supports extended battery life and thermally constrained designs.
- Embedded Control & Signal Processing Mid-range logic and on-chip memory for control loops, protocol handling and on-device data buffering.
- User I/O and Interface Bridging High I/O count enables implementation of display controllers, human-machine interfaces and multi-protocol bridging.
Unique Advantages
- Right-sized Logic and Memory: 15,408 logic elements with ~0.5 Mbits of embedded RAM balance capacity and cost for mid-range designs.
- Automotive-Ready Reliability: AEC‑Q100 qualification and −40°C to 125°C operating range support deployment in demanding automotive environments.
- Flexible Clocking: Multiple PLLs and dynamic reconfiguration capabilities simplify clock domain management and interface synchronization.
- Compact, Surface-Mount Package: 256‑LFBGA (14×14 UBGA) enables high-density PCB layouts while preserving ample I/O.
- Low-Voltage Operation: 1.15–1.25 V core supply reduces power draw and integrates with modern low-voltage power rails.
- Design Ecosystem: Part of the Cyclone III family with available device-level features and IP that aid development and system integration.
Why Choose EP3C16U256A7N?
The EP3C16U256A7N places mid-range FPGA capability into an automotive‑qualified, low-power package suitable for designers who need programmable logic, moderate embedded memory, and a high I/O count in a compact footprint. Its voltage and temperature specifications align with robust system requirements while the Cyclone III family architecture provides established device-level features for clocking, I/O flexibility and on-chip resources.
This device is well suited for teams building cost-sensitive, high-volume products that require dependable operation across wide temperature ranges and benefit from the Cyclone III device family’s development ecosystem and IP support.
Request a quote or submit a purchase inquiry to get pricing and availability for EP3C16U256A7N. Our team can assist with lead times, volume pricing and technical questions to help integrate this FPGA into your design.

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