EP3C16U256A7N

IC FPGA 168 I/O 256UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 168 516096 15408 256-LFBGA

Quantity 326 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-UBGA (14x14)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case256-LFBGANumber of I/O168Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs963Number of Logic Elements/Cells15408
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits516096

Overview of EP3C16U256A7N – Cyclone® III FPGA, 15,408 logic elements, 256‑LFBGA

The EP3C16U256A7N is an Intel Cyclone® III field-programmable gate array delivering mid-range logic capacity and low-power operation for cost-sensitive, high-volume designs. Built on the Cyclone III device family architecture, it combines 15,408 logic elements with on-chip embedded memory and flexible I/O to address embedded control, connectivity and mixed-signal interface tasks.

Qualified to AEC‑Q100 and specified for automotive grade use, this surface-mount FPGA is targeted at applications that require robust temperature range and regulated voltage operation with a compact 256‑LFBGA (256‑UBGA 14×14) footprint.

Key Features

  • Logic Capacity  15,408 logic elements and 963 logic array blocks provide mid-range programmable logic for control, signal processing and glue-logic implementations.
  • Embedded Memory  Approximately 0.5 Mbits (516,096 total RAM bits) of on-chip memory for buffering, FIFO and small data-storage requirements.
  • I/O Density & Standards  168 user I/Os to support multiple interfaces; device family supports common I/O standards and adjustable slew rates for system-level signal integrity.
  • Clock Management  Device family includes up to four phase-locked loops (PLLs) for clock synthesis, distribution and dynamic reconfiguration of phase and frequency.
  • Low-Voltage Core  Core supply range of 1.15 V to 1.25 V to support low-power system architectures.
  • Automotive Qualification  Automotive grade with AEC‑Q100 qualification and an extended operating temperature range of −40°C to 125°C for harsh-environment deployments.
  • Package & Mounting  256‑LFBGA (supplier package: 256‑UBGA, 14×14) in a surface-mount form factor for compact PCB designs.
  • RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

  • Automotive Systems  Sensor interfacing, vehicle networking interfaces and domain controllers where AEC‑Q100 qualification and wide temperature range are required.
  • Portable and Handheld Devices  Low-power operation supports extended battery life and thermally constrained designs.
  • Embedded Control & Signal Processing  Mid-range logic and on-chip memory for control loops, protocol handling and on-device data buffering.
  • User I/O and Interface Bridging  High I/O count enables implementation of display controllers, human-machine interfaces and multi-protocol bridging.

Unique Advantages

  • Right-sized Logic and Memory:  15,408 logic elements with ~0.5 Mbits of embedded RAM balance capacity and cost for mid-range designs.
  • Automotive-Ready Reliability:  AEC‑Q100 qualification and −40°C to 125°C operating range support deployment in demanding automotive environments.
  • Flexible Clocking:  Multiple PLLs and dynamic reconfiguration capabilities simplify clock domain management and interface synchronization.
  • Compact, Surface-Mount Package:  256‑LFBGA (14×14 UBGA) enables high-density PCB layouts while preserving ample I/O.
  • Low-Voltage Operation:  1.15–1.25 V core supply reduces power draw and integrates with modern low-voltage power rails.
  • Design Ecosystem:  Part of the Cyclone III family with available device-level features and IP that aid development and system integration.

Why Choose EP3C16U256A7N?

The EP3C16U256A7N places mid-range FPGA capability into an automotive‑qualified, low-power package suitable for designers who need programmable logic, moderate embedded memory, and a high I/O count in a compact footprint. Its voltage and temperature specifications align with robust system requirements while the Cyclone III family architecture provides established device-level features for clocking, I/O flexibility and on-chip resources.

This device is well suited for teams building cost-sensitive, high-volume products that require dependable operation across wide temperature ranges and benefit from the Cyclone III device family’s development ecosystem and IP support.

Request a quote or submit a purchase inquiry to get pricing and availability for EP3C16U256A7N. Our team can assist with lead times, volume pricing and technical questions to help integrate this FPGA into your design.

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