EP3C16M164C8N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 92 516096 15408 164-TFBGA |
|---|---|
| Quantity | 714 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 164-MBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 164-TFBGA | Number of I/O | 92 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of EP3C16M164C8N – Cyclone® III Field Programmable Gate Array (FPGA) 164-TFBGA
The EP3C16M164C8N is an Intel Cyclone® III family FPGA in a 164-TFBGA package designed for cost- and power-sensitive designs. It combines a mid-range logic capacity with embedded memory and flexible I/O to address high-volume applications that require compact, low-power programmable logic.
As a member of the Cyclone III device family, this device leverages the low-power TSMC process and family-level architecture to deliver efficient system integration and clock management for a variety of embedded and consumer applications.
Key Features
- Logic Capacity — 15,408 logic elements, providing substantial mid-range programmable logic resources for custom digital functions and control logic.
- Embedded Memory — Approximately 0.5 Mbits of on-chip RAM (516,096 total RAM bits) to support buffers, FIFOs, and local data storage without external memory.
- I/O Count & Package — 92 user I/Os in a 164-TFBGA (supplier package: 164-MBGA 8×8) surface-mount package for compact board designs.
- Low-Voltage Core — Core supply range of 1.15 V to 1.25 V, suitable for low-power system designs.
- Operating Range — Commercial-grade device rated for 0 °C to 85 °C operation.
- Family-Level System Features — Inherits Cyclone III capabilities such as low-power process technology, multi-PLL clock management, adjustable I/O slew control, and support for a wide selection of industry I/O standards to simplify system-level design.
- Compliance — RoHS-compliant for environmental and regulatory conformity.
Typical Applications
- Portable and Handheld Devices — Low-power Cyclone III architecture and compact 164-TFBGA package help extend battery life and reduce system size in portable electronics.
- Consumer Electronics — Mid-range logic and on-chip RAM enable feature integration such as user interface control, local data buffering, and protocol bridging.
- Embedded Control — 15,408 logic elements and flexible I/O make the device suitable for custom control logic, sensor interfacing, and peripheral management in embedded systems.
Unique Advantages
- Balanced Integration: Combines a significant logic count with embedded RAM to reduce dependence on external memory and lower BOM complexity.
- Compact Footprint: 164-TFBGA surface-mount package and 92 I/Os enable high-density board layouts for space-constrained designs.
- Low-Power Operation: Based on the Cyclone III low-power process and optimized architecture, the device supports power-sensitive applications without sacrificing integration.
- Flexible Clocking: Family-level PLL features provide robust clock management options to support varied timing and interface requirements.
- Regulatory Ready: RoHS compliance simplifies environmental qualification and procurement for many markets.
Why Choose EP3C16M164C8N?
The EP3C16M164C8N positions itself as a mid-range, low-power FPGA option within the Cyclone III family, offering 15,408 logic elements, approximately 0.5 Mbits of embedded memory, and 92 I/Os in a compact 164-TFBGA package. These attributes make it well-suited for designers seeking a balance of integration, power efficiency, and package density for commercial embedded and consumer applications.
Choosing this device provides access to Cyclone III family capabilities—such as low-power silicon, flexible I/O support, and family-level clocking resources—backed by established documentation and device architecture for scalable product development.
Request a quote or submit a parts inquiry to get pricing and availability for EP3C16M164C8N.

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