EP3C16F484I7N

The EP3C16F484I7N is a Cyclone® III field-programmable gate array in a 484‑ball BGA (23×23) surface-mount package. It provides 15,408 logic elements, approximately 0.5 Mbits (516,096 bits) of embedded memory and 346 user I/Os, and is specified for industrial operation from −40 °C to 100 °C.

As part of the Cyclone III device family, this FPGA targets cost- and power-sensitive designs that require a balance of integration, I/O density, and low static power. Family-level features emphasize low-power operation, flexible clocking, and a broad set of on-chip system features for embedded applications.

Key Features

• Logic Capacity 15,408 logic elements to implement custom digital logic, glue logic and control functions.
• Embedded Memory Approximately 0.5 Mbits (516,096 bits) of on-chip RAM for FIFOs, buffers, and local data storage.
• I/O and Package 346 user I/Os in a 484‑ball BGA (supplier package: 484‑FBGA, 23×23) optimized for high pin-count applications and surface-mount assembly.
• Voltage and Temperature Core supply range 1.15 V to 1.25 V and operating temperature −40 °C to 100 °C for industrial deployments.
• Low‑Power Silicon Cyclone III family architecture is based on a low-power process and silicon optimizations to minimize static power consumption for energy-sensitive designs.
• Clocking and Timing Family-level clock management features include phase-locked loop (PLL) resources for robust clock synthesis and distribution.
• I/O Standards and Signal Integrity Cyclone III family supports a broad range of I/O standards and on‑chip termination calibration to address signal-integrity and multi‑voltage interfacing needs.
• Design Ecosystem Supported by a collection of pre‑built IP and device family tools for faster integration and system-level functionality.
• RoHS Compliant Manufactured to meet RoHS environmental requirements.

Typical Applications

• Portable and handheld devices Low-power family characteristics help extend battery life and reduce cooling requirements in portable electronics.
• Industrial control and instrumentation Industrial temperature rating and high I/O count suit sensor interfacing, real-time control and I/O aggregation tasks.
• Communication and I/O bridging High I/O density and embedded memory make this FPGA suitable for protocol bridging, interface aggregation and custom peripheral logic.
• High-volume, cost-sensitive products Cyclone III family positioning for low cost and low power supports scalable designs intended for volume manufacturing.

Unique Advantages

• Balanced integration: Combines 15,408 logic elements with on-chip RAM and high I/O count to reduce external components and PCB complexity.
• Industrial-grade operation: Specified for −40 °C to 100 °C operation, enabling deployment in thermally demanding environments.
• Low static power: Family-level low-power process and silicon optimizations reduce standby power, supporting energy-conscious designs.
• Flexible clock management: On-chip PLL resources provide clock synthesis and phase control for complex timing domains.
• Design productivity: Availability of verified IP and Cyclone III family development resources accelerates bring-up and shortens time to market.

Why Choose EP3C16F484I7N?

The EP3C16F484I7N positions Cyclone III family capability in a compact 484‑BGA package, delivering a practical blend of logic, memory and I/O for industrial and cost-sensitive applications. Its industrial temperature rating, RoHS compliance, and core voltage range make it suitable for designs that require reliable operation across a wide thermal range.

Choose this device when you need a low-power FPGA platform with significant I/O density and embedded memory, supported by a family-level ecosystem of IP and design tools to help reduce development time and system BOM complexity.

If you would like pricing, lead-time or availability, request a quote or submit an inquiry and our team will respond with detailed commercial information.