EP3C16F484C7N

The EP3C16F484C7N is a Cyclone® III family FPGA designed for high-functionality, low-power, cost-sensitive applications. As a member of the Cyclone III device family, it leverages low-power TSMC process optimizations and family-level features to deliver a balance of logic capacity, on-chip memory and I/O integration.

This device provides 15,408 logic elements, 516,096 bits of on-chip RAM (approximately 0.5 Mbits), and 346 I/O pins in a compact 484-FBGA (23×23) surface-mount package, with a supply voltage range of 1.15–1.25 V and commercial operating temperature of 0 °C to 85 °C.

Key Features

• Core Logic  15,408 logic elements for implementing glue logic, control functions and mid-range FPGA designs.
• On-chip Memory  516,096 bits of embedded RAM (approximately 0.5 Mbits) for buffering, state storage and small-data structures.
• I/O Density  346 user I/O pins to support multiple interfaces and external peripherals in I/O-constrained designs.
• Power and Supply  Operates from a 1.15 V to 1.25 V core supply to align with low-power system architectures.
• Package and Mounting  484-ball FBGA (23×23) surface-mount package for compact PCB integration and high pin-count routing.
• Temperature and Grade  Commercial grade with operating range from 0 °C to 85 °C for standard commercial applications.
• Family-Level Low Power  Cyclone III family optimizations target low static power consumption through TSMC low-power (LP) process technology and power-aware design flows.
• Clock Management  Cyclone III family devices provide integrated PLL resources for clock generation and management (family-level feature).
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• Portable and Handheld Devices  Low-power family characteristics help extend battery life for compact, power-sensitive products.
• Consumer and Embedded Systems  On-chip RAM and mid-range logic density enable user interfaces, protocol bridging and control functions.
• Communications and Connectivity  High I/O count supports multiple peripheral and high-pin-count interface implementations.
• Thermally Challenged Designs  Family-level low-power operation reduces cooling requirements in constrained environments.

Unique Advantages

• Balanced Logic and Memory: 15,408 logic elements paired with approximately 0.5 Mbits of on-chip RAM gives designers the resources to implement mid-range FPGA functions without external memory for small buffers and state machines.
• High I/O Capacity: 346 I/O pins accommodate extensive peripheral interfacing and simplify board-level routing for multi-interface systems.
• Compact, High-Pin Package: 484-FBGA (23×23) package delivers a high pin count in a space-efficient footprint for dense PCB layouts.
• Low-Power Device Family: Leveraging the Cyclone III family’s low-power process and power-aware design flow helps reduce system power and cooling.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C to meet the environmental needs of standard commercial applications.
• Standards-Aligned Manufacturing: RoHS compliance supports environmental and regulatory requirements for commercial products.

Why Choose EP3C16F484C7N?

The EP3C16F484C7N positions itself as a practical mid-range Cyclone III FPGA option, combining 15,408 logic elements, roughly 0.5 Mbits of embedded RAM and 346 I/Os in a 484-FBGA package. It is well-suited to high-volume, low-power, cost-sensitive designs where compact package density and a healthy balance of logic, memory and I/O are required.

As part of the Cyclone III family, it benefits from family-level low-power process optimizations and device features aimed at reducing system power and simplifying clock and interface integration—making it a viable choice for engineering teams targeting efficient, scalable commercial products.

Request a quote or submit an inquiry for pricing and availability for EP3C16F484C7N. Our team will assist with lead time and volume pricing information.