EP3C16F484C8N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 346 516096 15408 484-BGA |
|---|---|
| Quantity | 855 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 346 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of EP3C16F484C8N – Cyclone® III FPGA, 15,408 logic elements, 484‑BGA
The EP3C16F484C8N is a Cyclone III field-programmable gate array (FPGA) from Intel, delivering a balance of logic capacity, embedded memory, and I/O in a compact 484‑BGA package. As a member of the Cyclone III device family, it targets high-volume, low-power, cost-sensitive applications and benefits from the family’s low-power TSMC process optimizations and system-level integration features.
Key Features
- Logic Capacity 15,408 logic elements provide flexible fabric for mid-range logic implementations and custom digital functions.
- On‑Chip Memory Approximately 0.5 Mbits of embedded memory (516,096 total RAM bits) for buffering, lookup tables, and system storage.
- I/O and Package 346 user I/Os in a 484‑BGA (484‑FBGA, 23×23) surface-mount package to support dense board-level connectivity.
- Power Supply Core supply range from 1.15 V to 1.25 V, enabling low-power operation consistent with Cyclone III family optimizations.
- Operating Range and Grade Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
- Family-Level System Features As part of the Cyclone III family, the device benefits from low-power architecture, multiple PLLs for clock management, and a broad ecosystem of IP and development tools.
- Security and Design Options Cyclone III family documentation describes LS variants offering configuration security and design separation features; Cyclone III devices support a range of system-level design flows and partitioning options.
- I/O Standard Support Family-level support for common I/O standards and multi-value on‑chip termination calibration to address signal-integrity and PVT variation challenges.
Typical Applications
- Portable and Handheld Devices Low-power family characteristics and compact packaging suit battery-powered, space-constrained designs.
- Cost‑Sensitive Consumer Electronics Mid-range logic density and integrated memory support feature-rich products while controlling BOM cost.
- Embedded Systems and Interfaces High I/O count and family-level clock management features enable peripheral bridging, protocol aggregation, and custom I/O solutions.
- High‑volume, Low‑power Designs The Cyclone III family focus on low static power makes this device appropriate for large-volume deployments where power and cost matter.
Unique Advantages
- Mid‑range Logic with Embedded Memory: 15,408 logic elements and ~0.5 Mbits of RAM deliver a balanced platform for control logic, data buffering, and custom processing.
- High I/O Density in a Compact Footprint: 346 I/Os in a 484‑FBGA (23×23) package simplifies routing for I/O‑intensive applications without a larger package.
- Low‑Power Family Architecture: Based on TSMC low‑power process technology, the Cyclone III family reduces static power, extending battery life and lowering cooling requirements.
- Commercial Temperature Range: Rated for 0 °C to 85 °C, suitable for a wide range of consumer and industrial-adjacent applications that require commercial-grade components.
- RoHS‑Compliant Supply: Meets RoHS requirements for environmentally constrained manufacturing and global supply chains.
- Broad Ecosystem Support: Cyclone III family documentation and IP resources enable faster integration with pre-built megafunctions and system-level building blocks.
Why Choose EP3C16F484C8N?
The EP3C16F484C8N provides a practical balance of logic density, embedded memory, and I/O capacity in a compact 484‑BGA package, making it well suited for designers of mid-range, cost-sensitive systems that require low-power operation. Its inclusion in the Cyclone III family means access to family-level low-power optimizations, clock management features, and a broad set of IP resources that accelerate development.
Choose this device when you need a commercial‑grade FPGA platform that scales for high-volume applications, offers a compact board footprint, and aligns with RoHS-compliant manufacturing practices.
Request a quote or submit a part inquiry to check availability and pricing for EP3C16F484C8N.

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