EP3C16M164C7N

The EP3C16M164C7N is a Cyclone III field-programmable gate array (FPGA) in a 164-TFBGA package designed for commercial applications. It combines mid-range logic density, on-chip embedded memory and a 92-pin I/O interface to address cost- and power-sensitive designs that require flexible logic integration and moderate on-chip resources.

Built on the Cyclone III device family architecture, this device targets low-power, high-functionality applications and leverages family-level features such as low-power process optimizations, integrated clock management, and a broad set of I/O options.

Key Features

• Logic Capacity — 15,408 logic elements (cells) and 963 LABs provide mid-range programmable logic resources for glue logic, protocol bridging, and control functions.
• Embedded Memory — Approximately 0.5 Mbits (516,096 bits) of on-chip RAM to store buffers, LUTs, and small data structures without external memory.
• I/O and Packaging — 92 user I/O pins in a 164-TFBGA (supplier package: 164-MBGA 8×8) surface-mount package suitable for compact PCBs.
• Voltage and Temperature — Core supply range of 1.15 V to 1.25 V and commercial operating temperature range of 0 °C to 85 °C for standard commercial designs.
• Low-Power Family Characteristics — Cyclone III family emphasis on low-power operation through a low-power process and silicon optimizations, supporting battery-powered and thermally constrained systems.
• Clock Management — Cyclone III family includes integrated PLL resources (family-level feature) for clock synthesis and distribution to support interface timing and system clocks.
• I/O Standards and Signal Integrity — Cyclone III family supports a wide set of I/O standards and features such as adjustable slew rates and on-chip termination calibration to help meet signal-integrity requirements.
• RoHS Compliant — Meets RoHS environmental compliance requirements.

Typical Applications

• Portable and Handheld Devices — Low-power family characteristics and compact 164-TFBGA packaging make the device suitable for battery-powered equipment where power and board area matter.
• Embedded Control and Processing — On-chip logic and embedded RAM enable implementation of control engines, protocol handlers, and lightweight embedded processing functions.
• Interface and I/O Bridging — 92 user I/Os and family-level support for multiple I/O standards allow flexible interfacing between sensors, peripherals, and host systems.
• Clocked Systems and Data Timing — Integrated PLL resources (family feature) support clock synthesis and distribution for communication interfaces and system timing.

Unique Advantages

• Balanced Mid-Range Integration: Combines 15,408 logic elements with approximately 0.5 Mbits of embedded RAM to consolidate discrete logic and small memory needs on a single device.
• Compact Package: 164-TFBGA (164-MBGA supplier package) surface-mount footprint reduces PCB area while preserving a 92-pin I/O interface for system connectivity.
• Low-Voltage Operation: Core supply of 1.15–1.25 V aligns with low-power design goals and family-level low-power optimizations to help reduce energy consumption in the system.
• Commercial Temperature Grade: Rated for 0 °C to 85 °C operation to meet requirements of standard commercial electronic products.
• Family-Level Ecosystem: Leverages Cyclone III family features such as PLLs, multiple I/O standard support, and pre-built IP availability to accelerate development and system integration.
• Environmentally Compliant: RoHS compliance supports regulatory requirements for many global markets.

Why Choose EP3C16M164C7N?

The EP3C16M164C7N is positioned for designers seeking a commercially graded, mid-density FPGA that balances logic capacity, embedded memory and flexible I/O in a compact surface-mount package. Its Cyclone III family heritage provides low-power design optimizations and accessible system-level features—making it a practical choice for cost- and power-conscious applications that require programmable logic integration without excess capacity.

This device suits teams implementing protocol bridging, control functions, or moderate embedded processing where a combination of 15,408 logic elements, roughly 0.5 Mbits of on-chip RAM, and 92 I/Os can reduce external component count and simplify board-level design while relying on the Cyclone III ecosystem for IP and clock-management resources.

Request a quote or submit a procurement inquiry to check pricing and availability for EP3C16M164C7N.