EP3C16Q240C8
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 160 516096 15408 240-BFQFP |
|---|---|
| Quantity | 350 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 160 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of EP3C16Q240C8 – Cyclone® III Field Programmable Gate Array (FPGA) IC, 160 I/O, 15,408 LEs, 240-BFQFP
The EP3C16Q240C8 is a Cyclone III family FPGA offering a balance of logic capacity, on-chip memory, and low-power operation for cost- and power-sensitive designs. It implements 15,408 logic elements distributed across 963 LABs and approximately 0.5 Mbits of embedded RAM, making it suitable for mid-range programmable logic tasks.
Designed as part of the Cyclone III device family, the device targets high-volume, low-power applications that require flexible I/O, integrated clock management and system-level integration options common to the family.
Key Features
- Core Capacity — 15,408 logic elements organized across 963 LABs to support moderate-density logic functions and custom datapaths.
- Embedded Memory — 516,096 total RAM bits (approximately 0.5 Mbits) for FIFOs, buffering, and on-chip data storage.
- I/O Density — 160 user I/O pins to interface with sensors, peripherals, and external logic in I/O-constrained designs.
- Clock Management — Family-level support for advanced clocking: four phase-locked loops (PLLs) per device with multiple outputs, enabling flexible clock synthesis and distribution.
- Low-Power Architecture — Based on the Cyclone III low-power device family characteristics, optimized for reduced static power consumption suitable for battery-backed or thermally constrained environments.
- Supply Voltage — Core voltage range 1.15 V to 1.25 V for predictable power budgeting in system design.
- Package & Mounting — 240-BFQFP surface-mount package (supplier package: 240-PQFP, 32×32 mm) for compact board-level integration.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature, appropriate for commercial electronics applications.
- RoHS Compliant — Meets RoHS requirements for environmental and regulatory compatibility.
Typical Applications
- Battery-powered and portable systems — Low-power family design and reduced static power make the device suitable for handheld and portable instruments.
- Consumer and high-volume products — Mid-range logic and memory capacity address cost-sensitive, volume-driven designs that require programmable logic.
- Sensor and interface aggregation — 160 I/O pins enable aggregating multiple sensors, buses, or peripheral interfaces on a single device.
- Embedded control and soft processors — On-chip resources and Cyclone III family support for embedded processor integration offer a platform for custom control and protocol handling.
Unique Advantages
- Balanced logic and memory — 15,408 logic elements combined with ~0.5 Mbits of RAM provide a practical balance for control, filtering, and data path functions without external SRAM.
- Rich I/O headroom — 160 user I/Os reduce the need for external I/O expanders, simplifying PCB routing and BOM.
- Integrated clock synthesis — Multiple PLLs at the family level enable robust clock domain management and flexible timing architectures.
- Low-voltage operation — 1.15–1.25 V core supply helps contain power consumption for energy-conscious applications.
- Compact surface-mount package — 240-BFQFP (240-PQFP, 32×32) supports dense board layouts while keeping assembly straightforward.
- Regulatory readiness — RoHS compliance supports global manufacturing and environmental requirements.
Why Choose EP3C16Q240C8?
EP3C16Q240C8 positions itself as a practical Cyclone III FPGA option for designers needing mid-range programmable logic, moderate on-chip memory, and substantial I/O in a low-power commercial-grade device. Its combination of 15,408 logic elements, approximately 0.5 Mbits of embedded RAM, and 160 I/Os supports a broad set of consumer, portable, and high-volume applications where power efficiency and integration matter.
Choosing this device provides a clear upgrade path within the Cyclone III family and access to the device-level features described in the Cyclone III device documentation—enabling predictable integration, scalable designs, and straightforward supply-chain compatibility for commercial products.
Request a quote or submit an inquiry to evaluate EP3C16Q240C8 for your next design and to discuss availability and pricing.

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