EP3C16Q240C8N

The EP3C16Q240C8N is a Cyclone® III field programmable gate array (FPGA) in a 240‑pin BFQFP surface‑mount package. It delivers 15,408 logic elements and approximately 0.5 Mbits of embedded memory, making it suited for high‑volume, low‑power, cost‑sensitive designs that require moderate logic density and flexible I/O integration.

Built on the Cyclone III device family architecture, this device targets commercial applications that need efficient on‑chip resources, configurable I/O, and low static power consumption within a compact 32 × 32 mm package footprint.

Key Features

• Logic Capacity — 15,408 logic elements provide the programmable fabric for custom logic, control, and glue‑logic functions.
• Embedded Memory — 516,096 bits of on‑chip RAM (approximately 0.5 Mbits) for data buffering, FIFOs, and small working memories.
• I/O Count & Flexibility — 160 user I/O pins to support a wide range of external interfaces and board-level connectivity requirements.
• Power Supply — Core voltage requirement of 1.15 V to 1.25 V aligned with Cyclone III family low‑power operation.
• Package & Mounting — 240‑pin BFQFP (supplier package noted as 240‑PQFP, 32×32) in a surface‑mount form factor for compact PCB designs.
• Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliant — Meets RoHS requirements for lead‑free assembly and environmental compliance.
• Cyclone III Family Capabilities — Family features include low‑power silicon optimizations, programmable PLLs for clock management, high memory‑to‑logic and multiplier‑to‑logic ratios, and a broad set of supported I/O standards (family‑level characteristics).

Typical Applications

• Portable and Handheld Devices — Low static power characteristics and moderate logic density enable extended battery life and compact implementations.
• Embedded Control and System Glue Logic — Ample logic elements and on‑chip memory support custom control, protocol bridging, and system integration tasks.
• I/O‑Constrained Systems — High I/O count makes this device suitable where multiple external peripherals and interfaces must be routed to a single FPGA.
• Low‑Cost, High‑Volume Products — Cyclone III family positioning for cost‑sensitive applications aligns with commercial product production and BOM optimization.

Unique Advantages

• Balanced Logic and Memory — 15,408 logic elements paired with ~0.5 Mbits of embedded RAM simplifies implementation of mid‑range logic and buffering without external memory.
• Compact Package Footprint — 240‑pin BFQFP (32×32) surface‑mount package enables dense PCB layouts while retaining accessible I/O counts.
• Low‑Power Family Design — Part of the Cyclone III family engineered for reduced static power, helping designs meet tighter power budgets.
• Flexible Supply and Thermal Envelope — Standard commercial voltage and 0 °C to 85 °C operating range match typical consumer and industrial‑adjacent electronics requirements (commercial grade).
• Environmentally Compliant — RoHS compliance supports modern assembly and regulatory expectations.

Why Choose EP3C16Q240C8N?

The EP3C16Q240C8N provides a practical balance of programmable logic, embedded memory, and I/O density in a compact, surface‑mount package. As a member of the Cyclone III family, it brings the family’s low‑power silicon advantages and platform features to mid‑range FPGA designs where cost, power, and integration matter.

This device is well suited for engineering teams building commercial products that require scalable logic resources, moderate on‑chip memory, and high I/O capability while maintaining a compact PCB footprint and RoHS compliance.

Request a quote or submit an inquiry today to learn about availability, lead times, and pricing for EP3C16Q240C8N.