EP3C16U256C6

The EP3C16U256C6 is a Cyclone® III field-programmable gate array from Intel, offering a balance of mid-range programmable logic, embedded memory, and plentiful I/O in a compact 256-ball LFBGA package. It targets cost- and power-sensitive designs that require flexible I/O and on-chip resources in a commercial-temperature device.

With 15,408 logic elements and approximately 0.5 Mbits of embedded memory (516,096 bits), this surface-mount FPGA supports applications that need moderate logic density, extensive I/O (168 pins), and low-voltage operation (1.15 V–1.25 V).

Key Features

• Core Capacity  15,408 logic elements provide mid-range programmable logic capacity for glue logic, protocol bridging, and custom peripheral integration.
• Embedded Memory  Approximately 0.5 Mbits of on-chip RAM (516,096 bits) for buffers, FIFOs, and small data storage within the FPGA fabric.
• I/O Density & Flexibility  168 user I/Os accommodate multiple interfaces and signal domains; the Cyclone III family supports a wide set of I/O standards for system-level compatibility.
• Low-Voltage Operation  Nominal core supply of 1.15 V to 1.25 V, enabling lower power consumption in space- and energy-sensitive designs.
• Low-Power Family Architecture  Cyclone III family devices are built on a low-power process and power-aware design flow to reduce static and dynamic power where system-level energy savings matter.
• Clock Management  Family-level clocking resources include up to four phase-locked loops (PLLs) per device for robust clock synthesis, distribution, and dynamic reconfiguration.
• Package & Mounting  256-LFBGA (supplier package listed as 256-UBGA, 14 × 14 mm), surface-mount format ideal for compact PCB assemblies.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation to match standard commercial applications.
• Regulatory Compliance  RoHS-compliant manufacturing to meet environmental and supply-chain requirements.

Typical Applications

• Portable and Handheld Devices  Low-power Cyclone III architecture and modest logic density help extend battery life while enabling on-device signal conditioning and control.
• Consumer Electronics  Flexible I/O and embedded memory support display controllers, interface bridging, and feature-rich consumer peripherals.
• Communications and Networking  Clock management (PLLs) and a broad set of supported I/O standards make the device suitable for mid-range protocol handling, buffering, and timing-critical interfaces.
• Embedded Control and Instrumentation  On-chip memory and logic elements enable custom control logic, sensor interfacing, and local data processing in compact systems.

Unique Advantages

• Balanced Logic and Memory  15,408 logic elements combined with ~0.5 Mbits of embedded RAM deliver a practical mix of resources for many mid-range designs without excess cost.
• High I/O Count  168 user I/Os reduce the need for external I/O expanders and help simplify board-level routing for multi-interface products.
• Low-Voltage, Low-Power Operation  1.15 V–1.25 V core supply and family-level low-power process options help reduce system power consumption and thermal load.
• Compact Surface-Mount Package  256-LFBGA (14 × 14 mm UBGA) enables high-density PCB designs while maintaining manufacturability with surface-mount assembly.
• Design Ecosystem  As part of the Cyclone III family, the device benefits from field-proven architecture and family-level features such as multiple PLLs and a range of I/O standards for easier system integration.

Why Choose EP3C16U256C6?

The EP3C16U256C6 positions itself as a practical FPGA choice for designers who need a mid-range, low-voltage programmable device with substantial I/O and embedded memory in a compact surface-mount package. Its combination of 15,408 logic elements, approximately 0.5 Mbits of on-chip RAM, and 168 I/Os makes it well suited to cost- and power-conscious commercial applications that require flexible interfacing and on-board processing.

Choosing this Cyclone III device provides a clear path to deploy moderate-complexity logic and interface functions while leveraging family-level features—such as low-power silicon, multiple PLLs, and broad I/O standard support—that simplify development and integration in commercial systems.

Request a quote or submit a pricing inquiry to learn about availability and volume options for EP3C16U256C6.